MCF52277CVM160 Freescale Semiconductor, MCF52277CVM160 Datasheet - Page 26

IC MCU 32BIT 166.67MHZ 196MAPBGA

MCF52277CVM160

Manufacturer Part Number
MCF52277CVM160
Description
IC MCU 32BIT 166.67MHZ 196MAPBGA
Manufacturer
Freescale Semiconductor
Series
MCF5227xr
Datasheet

Specifications of MCF52277CVM160

Core Processor
Coldfire V2
Core Size
32-Bit
Speed
166.67MHz
Connectivity
CAN, EBI/EMI, I²C, SPI, SSI, UART/USART, USB OTG
Peripherals
DMA, LCD, PWM, WDT
Number Of I /o
55
Program Memory Type
ROMless
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
196-MAPBGA
Controller Family/series
ColdFire
Program Memory Size
128KB
Ram Memory Size
128KB
Cpu Speed
160MHz
No. Of Timers
1
Embedded Interface Type
I2C, SPI, UART, USB
No. Of Pwm Channels
1
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCF52277CVM160
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MCF52277CVM160J
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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Electrical Characteristics
26
DD10 Input Data Hold Relative to DQS
DD11 DQS falling edge from SDCLK rising (output hold time) t
Num
DD8
DD9
The frequency of operation is either 2x or 4x the FB_CLK frequency of operation. FlexBus and SDRAM clock operate at the
same frequency as the internal bus clock.
SD_CLK is one SDRAM clock in ns.
Pulse-width high plus pulse-width low cannot exceed minimum or maximum clock period.
Command output valid should be one-half the memory bus clock (SD_CLK) plus some minor adjustments for process,
temperature, and voltage variations.
This specification relates to the required input setup time of today’s DDR memories. The device’s output setup should be larger
than the input setup of the DDR memories. If it is not larger, then the input setup on the memory will be in violation.
MEM_DATA[31:24] is relative to MEM_DQS[3], MEM_DATA[23:16] is relative to MEM_DQS[2], MEM_DATA[15:8] is relative to
MEM_DQS[1], and MEM_DATA[7:0] is relative MEM_DQS[0].
The first data beat will be valid before the first rising edge of DQS and after the DQS write preamble. The remaining data beats
will be valid for each subsequent DQS edge.
This specification relates to the required hold time of today’s DDR memories. MEM_DATA[31:24] is relative to MEM_DQS[3],
MEM_DATA[23:16] is relative to MEM_DQS[2], MEM_DATA[15:8] is relative to MEM_DQS[1], and MEM_DATA[7:0] is relative
MEM_DQS[0].
Data input skew is derived from each DQS clock edge. It begins with a DQS transition and ends when the last data line
becomes valid. This input skew must include DDR memory output skew and system-level board skew (due to routing or other
factors).
Data input hold is derived from each DQS clock edge. It begins with a DQS transition and ends when the first data line becomes
invalid.
Data and Data Mask Output Hold (DQS→DQ) Relative
to DQS (DDR Write Mode)
Input Data Skew Relative to DQS (Input Setup)
Characteristic
MCF5227x ColdFire
Table 15. DDR Timing Specifications (continued)
®
Microprocessor Data Sheet, Rev. 8
Symbol
DQLSDCH
t
t
DQDMI
t
DVDQ
DIDQ
0.25 × SD_CLK
+ 0.5ns
Min
1.0
0.5
Max
1
Freescale Semiconductor
Unit
ns
ns
ns
ns
Notes
7
8
9

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