MCF5274CVM166 Freescale Semiconductor, MCF5274CVM166 Datasheet - Page 14

• Manufacturer Part Number: MCF5274CVM166
• Description: IC MPU 32BIT 166MHZ 256-MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: MCF527xr

Specifications of MCF5274CVM166

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 166MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
• Peripherals: DMA, WDT
• Number Of I /o: 69
• Program Memory Type: ROMless
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.4 V ~ 1.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-MAPBGA
• Embedded Interface Type: I2C, SPI, USB, UART
• Digital Ic Case Style: BGA
• No. Of Pins: 256
• Operating Temperature Range: -40°C To +85°C
• Processor Type: 68K/ColdFire V2
• Rohs Compliant: Yes
• Family Name: MCF5xxx
• Device Core: ColdFire
• Device Core Size: 32b
• Frequency (max): 166MHz
• Instruction Set Architecture: RISC
• Operating Supply Voltage (max): 1.6V
• Operating Supply Voltage (min): 1.4V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 256
• Package Type: MA-BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Compliant

G
M
A
B
C
D
E
F
H
K
N
P
R
T
J
L
TXCLK
FEC1_
FEC1_
FEC1_
FEC1_
FEC1_
FEC1_
DT1IN DT1OUT
SCAS
RXD3
TXER
TXD3
TXD0
MDIO
Mechanicals/Pinouts
6
6.1
Figure 3
group and shows which signals are muxed and bonded on each of the device packages.
14
VSS
VSS
VSS
SD_
D31
D30
D27
D25
OE
1
1
SD_CS1
SD_WE
FEC1_
FEC1_
FEC1_
FEC1_
FEC1_
FEC1_
FEC1_
DT2IN
RXD1
RXD2
RXER
TXEN
SRAS
VREF
TXD2
TXD1
MDC
SD_
SD_
D29
D26
D24
2
2
is a consolidated MCF5274/75 pinout for the 256 MAPBGA package.
Mechanicals/Pinouts
256 MAPBGA Pinout
DT0OUT
DT2OUT
DT3OUT
SD_CKE
TXCLK
FEC1_
FEC1_
FEC0_
FEC0_
FEC0_
FEC0_
DT0IN
RXDV
RXD0
TXER
TXD3
TXD2
BS3
D28
D23
D22
D21
3
3
SD_DQS3
MCF5275 Integrated Microprocessor Family Hardware Specification, Rev. 4
RXCLK
FEC1_
FEC1_
FEC0_
FEC0_
FEC0_
FEC0_
DT3IN
RXER
TXEN
TXD1
TXD0
CRS
VDD
D20
D19
D18
D17
NC
NC
TS
4
4
Figure 3. MCF5274 and MCF5275 Pinout (256 MAPBGA)
SD_DQS2
SD_VDD
SD_VDD
SD_VDD
SD_CS0
FEC1_
FEC0_
FEC0_
FEC0_
RXDV
OVDD
OVDD
OVDD
RXD2
RXD3
COL
VSS
VSS
BS2
D16
5
5
DDR_CLK
SD_VDD
SD_VDD
SD_VDD
SD_A10
RXCLK
FEC0_
FEC0_
FEC0_
FEC0_
OVDD
OVDD
OVDD
RXD0
RXD1
COL
OUT
VSS
VSS
CS0
TIP
6
6
DDR_CLK
SD_VDD SD_VDD OVDD
SD_VDD SD_VDD OVDD
U0RTS
FEC0_
FEC0_
FEC0_
OVDD
OVDD
MDIO
MDC
CRS
VSS
VSS
VSS
VSS
VSS
OUT
CS1
R/W
7
7
U0RXD
U0TXD
U0CTS
U2RTS
RCON
OVDD SD_VDD SD_VDD SD_VDD
OVDD SD_VDD SD_VDD
VDD
VDD
VSS
VSS
VSS
VSS
TEA
8
8
U1RXD
U1CTS
U1RTS
U2CTS DDATA3 DDATA1
U2TXD
U2RXD
U1TXD
TEST
VSS
VSS
VSS
VSS
9
9
DDATA2 DDATA0
OVDD
OVDD
PST2
PST3
I2C_
I2C_
VSS
SDA
SCL
CS7
VSS
VSS
VSS
VSS
10
10
SD_VDD SD_VDD
SD_VDD SD_VDD
OVDD
OVDD
OVDD
PST0
PST1
CS6
VSS
VSS
A23
A22
A21
11
11
SD_VDD
CLKOUT
QSPI_
QSPI_
QSPI_
OVDD
OVDD
OVDD
DOUT
CS5
VSS
CS2
CS0
A20
A19
A18
12
NC
12
Table 2
MOD1
MOD0
QSPI_
QSPI_
SUSP
USB_
IRQ7
IRQ2
IRQ1
VDD
CS4
CS3
CS2
CLK
CLK
CS3
A17
A16
A15
DIN
13
13
TA
Freescale Semiconductor
lists the signals by
RSTOUT RESET
USB_TN USB_TP VSSPLL K
SPEED
DSCLK
JTAG_
TRST/
QSPI_
USB_
USB_
TXEN
TEST
IRQ4
IRQ3
PLL_
CS1
A14
A13
A12
14
EN
14
A7
A5
A2
USB_RP USB_RN J
VDDPLL
QSPI_
VREF
USB_
USB_
BKPT
IRQ5
TDO/
TMS/
DSO
SD_
CLK
RXD
CLK
A10
A11
15
A6
A4
A1
15
PSTCLK
TDI/DSI R
EXTAL
TCLK/
TSIZ1
TSIZ0
IRQ6
XTAL
VSS
VSS
VSS
16
16
A9
A8
A3
A0
M
C
D
G
H
N
A
B
E
F
L
P
T