FT2232HL-REEL FTDI, Future Technology Devices International Ltd, FT2232HL-REEL Datasheet - Page 59

• Manufacturer Part Number: FT2232HL-REEL
• Description: IC USB UART/FIFO DUAL HS 64LQFP
• Manufacturer: FTDI, Future Technology Devices International Ltd
• Series: USBmadeEZ-FIFOr

Specifications of FT2232HL-REEL

• Features: USB to UART and/or FIFO, SPI, I2C, JTAG
• Number Of Channels: 2, DUART
• Fifo's: 4096 Byte
• Protocol: RS-232, RS-422, RS-485
• Voltage - Supply: 3 V ~ 3.6 V
• With Parallel Port: Yes
• With Auto Flow Control: Yes
• With Modem Control: Yes
• With Cmos: Yes
• Mounting Type: Surface Mount
• Package / Case: 64-LQFP
• Voltage: 3.0 V ~ 3.6 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 768-1024-2; FT2232HL - REEL

Table 8.2 Reflow Profile Parameter Values
Table 8.3 Package Reflow Peak Temperature
SnPb Eutectic and Pb free (non green material)
Pb Free (green material) = 260 +5/-0 deg C
Time Maintained Above Critical Temperature
Time within 5°C of actual Peak Temperature
Time for T= 25°C to Peak Temperature, T
Average Ramp Up Rate (T
- Temperature Max (T
- Temperature Min (T
- Time (t
Peak Temperature (T
- Temperature (T
Package Thickness
Profile Feature
Ramp Down Rate
≥
< 2.5 mm
- Time (t
Preheat
s
2.5 mm
Copyright © 2010 Future Technology Devices International Limited
Min to t
(t
T
L
p
:
)
L
)
s
Max)
s
s
L
)
Min.)
Max.)
FT2232H DUAL HIGH SPEED USB TO MULTIPURPOSE UART/FIFO IC
s
p
)
to T
p
)
p
Pb Free Solder Process
Volume mm3 < 350
235 +5/-0 deg C
220 +5/-0 deg C
(green material)
3°C / second Max.
60 to 120 seconds
60 to 150 seconds
6°C / second Max.
30 to 40 seconds
8 minutes Max.
150°C
200°C
217°C
260°C
SnPb Eutectic and Pb free (non
green material) Solder Process
Document No.: FT_000061
Volume mm3 >=350
220 +5/-0 deg C
220 +5/-0 deg C
Clearance No.: FTDI#77
3°C / Second Max.
Datasheet Version 2.10
60 to 120 seconds
60 to 150 seconds
6°C / second Max.
20 to 40 seconds
6 minutes Max.
see Table 8.3
100°C
150°C
183°C
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