QMSS-104-06.75-H-D-A Samtec Inc, QMSS-104-06.75-H-D-A Datasheet
QMSS-104-06.75-H-D-A
Manufacturer Part Number
QMSS-104-06.75-H-D-A
Description
CONN HEADER .635MM 208POS DL SMD
Manufacturer
Samtec Inc
Series
Q2™ QMSSr
Specifications of QMSS-104-06.75-H-D-A
Connector Type
Header, Outer Shroud Contacts
Number Of Positions
208
Pitch
0.025" (0.64mm)
Number Of Rows
2
Mounting Type
Surface Mount
Features
Board Guide, Ground Bus (Plane), Shielded
Contact Finish
Gold
Contact Finish Thickness
30µin (0.76µm)
Mated Stacking Heights
11mm
Height Above Board
0.250" (6.35mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
QMSS-104-11-H-D-A
SAM8179
SAM8179
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
QMSS-104-06.75-H-D-A
Manufacturer:
Samtec Inc.
Quantity:
12 000
Company:
Part Number:
QMSS-104-06.75-H-D-A-GP
Manufacturer:
Samtec Inc.
Quantity:
12 000
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?QMSS
Insulator Material:
Liquid Crystal
Polymer
Terminal, Ground
Plane & Shield Material:
Phosphor Bronze
Plating:
Au over 50µ" (1,27µm) Ni
(Tin on Ground Plane Tail)
Current Rating:
Signal Contact: 1.8A @ 80°C
Power Contact: 3.95A @ 80°C
Ground Plane: 8.9A @ 80°C
Voltage Rating:
300 VAC mated with QFSS
Operating Temp:
-55°C to +125°C
RoHS Compliant:
Yes
Processing:
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10mm) .004" max (026-078)
(0,15mm) .006" max (104)
Board Stacking:
For applications requiring
more than two connectors
per board or 4 banks or more,
contact ipg@samtec.com
SHIELDED GROUND PLANE HEADER
Note: Some lengths,
styles and options are
non-standard, non-returnable.
F-211
SPECIFIC OPTION
• Headers without
• 8 Power Pins/End
• 4 or 8 Power Pins/End
• Guide Post
• Edge Mount
• Hot Pluggable
Call Samtec.
SPECIFICATIONS
(0,635mm) .025"
Alignment Pins
for (2,36mm) .093"
thick board
QMSS SERIES
APPLICATION
APPLICATION
QFSS
QMSS
(11,00)
.433
Board Mates:
QFSS
Cable Mates:
6QDPS
QMSS
(2,29)
(3,18)
.090
.125
See SO Series for precision
S
(2,00) .07874
APPLICATIONS
No. of Banks x (21,34) .840 + (13,21) .520
TM
40 signals + 12 grounds to shield = –D)
No. of Banks x (21,34) .840 - (0,51) .020
–026, –052, –078, –104
–016, –032, –048, –064
machined standoffs.
SO S i
(21,35) .840
(16 pairs per bank = –D–DP)
–D
(0,635)
PINS PER ROW
(52 total pins per bank
.025
• Increased
• Integral guide post
NO. OF PAIRS
insertion depth
f
–PC4
i i
WWW.SAMTEC.COM
QMSS–026–06.75–L–D–A
(0,23)
.009
Integral metal plane for
power or ground
–D–DP
QMSS–032–06.75–L–D–DP–PC4
Grounds
to shield
Signal Pairs
Differential routing
06.75
01
01
02
02
01
(7,26)
(6,35)
.286
.250
(2,54)
.100
PLATING
Pins, Shield and
= 10µ" (0,25µm)
Signal Pin tails,
OPTION
Gold on Signal
Tin on Ground
(Gold fl ash on
Ground Plane
Plane tails)
(6,73)
11mm Stack Height
Single-Ended Signaling
Differential Pair Signaling
Performance data for other stack heights and complete
test data available at www.samtec.com?QMSS or
contact sig@samtec.com
.265
(0,25)
.010
–L
(2,31)
.091
(7,52)
Increased insertion
depth for rugged applications
.296
(2,54)
(6,35)
.100
TYPE
.250
= Differential Pair
= Single-Ended
–D–DP
–D
Based on ± 10% Impedance/Crosstalk
QMSS–052–06.75–L–D–A
A
2.3 GHz / 4.6 Gbps
1.4 GHz / 2.8 Gbps
Optional
Power Pins
NOMINAL
(1,30mm)
(N/A with –PC4)
WIPE
.051"
OPTION
–104 or –A)
= (5,50mm)
fi lm Pick &
OTHER
Polyimide
Place Pad
= 4 Power
.217" DIA
–PC4
Pins/End
(N/A with
–K
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