75003-0305 Molex Inc, 75003-0305 Datasheet - Page 4

• Manufacturer Part Number: 75003-0305
• Description: CONN PLUG 12POS 1.2MM VERT SMD
• Manufacturer: Molex Inc
• Series: Plateau HS Mezz™ 75003r

Specifications of 75003-0305

• Connector Type: Differential Pair Array, Male
• Number Of Positions: 12
• Pitch: 0.047" (1.20mm)
• Number Of Rows: 2
• Mounting Type: Surface Mount
• Features: Board Guide
• Contact Finish: Gold
• Contact Finish Thickness: 30µin (0.76µm)
• Mated Stacking Heights: 10mm, 12mm, 20mm
• Height Above Board: 0.325" (8.25mm)
• Pitch Spacing: 1.2mm
• No. Of Contacts: 12
• Gender: Plug
• Contact Plating: Gold
• No. Of Rows: 2
• Contact Termination: Surface Mount Vertical
• Product Type: Receptacles
• Mounting Style: Wire
• Number Of Positions / Contacts: 8
• Housing Material: High Temperature Thermoplastic
• Contact Material: High Performance Alloy (HPA)
• Voltage Rating: 30 V
• Current Rating: 1.5 A
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 075003-0305; 075003-0305-E; 0750030305; 0750030305-E; 75003-0305-E; 750030305; 750030305-E; WM17208

REVISION:
DOCUMENT NUMBER:
B
5.4 Environmental Performance
PS-75005-001
5.3.2 Durability: Mate and unmate for 25 cycles at 500 cycles per hour, without physical damage
5.3.3 Durability (Preconditioning): Mate and unmate for 5 cycles at 500 cycles per hour, without
5.3.4 Reseating: Mate and unmate for 3 cycles, without physical damage.
5.3.4 Vibration: There shall be no evidence of physical damage or a change in contact resistance
5.3.6 Retention Force (Chicklet to Housing): Specimens shall remain mated when a force of
5.3.7 Axial Force (Soldered Housing to Board): Specimens shall remain attached to the board
5.3.8 Side Load Force (Soldered Housing to Board): Specimens shall remain attached to the
5.4.1 Thermal Shock: There shall be no change in contact resistance greater than 10mOhms from
ECR/ECN INFORMATION:
EC No:
DATE:
# of Ckts
12
24
48
72
or exceeding a change in contact resistance of 10 mOhms. Test per EIA-364-09.
physical damage or exceeding a change in contact resistance of 10 mOhms. Test per EIA-
364-09.
of 10 mOhms when mated specimens are subjected to 3.10 G’s rms between 20-500 Hz
for 15 minutes in each of 3 mutually perpendicular planes(X-Y-Z). Test per EIA-364-28,
Test Condition VII, Condition D.
3.33N is applied. The load shall be applied in the axial direction. Test per EIA-364-38.
when a minimum force of 26.69 N per ground peg is applied. See Table. Assumes 50%
peg coverage with solder fillet at the top, per AS-75005-001.
board when a minimum force of 17.79 N per ground peg is applied. See Table. Assumes
50% peg coverage with solder fillet at the top, per AS-75005-001.
initial when mated specimens are subjected to 10 cycles between -55
minute dwell times. Test per EIA-364-32, Condition 1.
UCP2003-2204
2003 / 04 / 10
PRODUCT SPECIFICATION
HIGH SPEED MEZZANINE
# Differential
TITLE:
CREATED / REVISED BY:
Pairs
12
24
36
6
Ken Stiles
BOARD TO BOARD CONNECTOR SYSTEM
PRODUCT SPECIFICATION FOR THE
HIGH SPEED MEZZANINE
Axial Force (N)
160.14
240.21
53.38
80.07
Min
CHECKED BY:
Ken Stiles
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
Side Load Force (N)
106.74
160.11
o
35.58
53.37
Min
C and 85
Manny Banakis
APPROVED BY:
o
C with 30
SHEET No.
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