75003-0310 Molex Inc, 75003-0310 Datasheet

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... ECR/ECN INFORMATION: UCP2003-2204 EC No: B DATE: 2003 / DOCUMENT NUMBER: TS-75005-001 TEST SUMMARY HIGH SPEED MEZZANINE 75003 Plug Assembly Table of Contents Scope Product Description Applicable Documents and Specifications Test Sequences 4.1 Sample Preparation 4.2 EIA Test Sequences 4.3 Additional Sequences Test Results 5.1 EIA Testing 5 ...

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... DOCUMENT NUMBER: TS-75005-001 TEST SUMMARY Plug Assembly 75003-2000 Plug Assembly 75003-0008 Receptacle Assembly 75005-2000 Receptacle Assembly 75003-0006 TITLE: TEST SUMMARY FOR THE HIGH SPEED MEZZANINE BOARD TO BOARD CONNECTOR SYSTEM CREATED / REVISED BY: Ken Stiles CHECKED BY: APPROVED BY: Ken Stiles Manny Banakis TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC SHEET No ...

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... Individual Ground Assemblies. (75005-0006 and 75003-0008) 2) The sample size for sequence 4, consisted of 10 High Speed Mezzanine Assemblies and 24 Individual Ground Assemblies. (75005-0006 and 75003-0008) 3) The sample size for sequence 4 also included 2 high speed test boards with assemblies that will be sent through the entire sequence. The boards will be checked for any change in the High Speed performance of the connectors ...

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... Reworked Parts (see note 6) Notes: 1) The sample size for sequence A consisted of 3 Assemblies (75005-0006 and 75003-0008). 2) The sample size for sequence B consisted of 30 Individual Contact Pairs and 1 Fully Powered Assembly. (This testing consisted of P/N 74874-0006 which was replaced by P/N’s 75005- 0006 and 75003-0008 however the electrical interface did not change ...

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HIGH SPEED MEZZANINE 5.0 Testing Sequences 5.1 EIA 364-1000.01 Results Treatment After Durability After Thermal Aging Treatment After Durability After Thermal Shock After Cyclic Humidity After Reseating Treatment After Durability After Thermal Aging After Vibration REVISION: ECR/ECN INFORMATION: UCP2003-2204 EC ...

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HIGH SPEED MEZZANINE Treatment After Durability After Thermal Aging After FMG After Thermal Disturbance After Reseating Treatment After Durability After Thermal Aging After Thermal Cycling After Reseating REVISION: ECR/ECN INFORMATION: UCP2003-2204 EC No: B DATE: 2003 / ...

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... HIGH SPEED MEZZANINE Additional Testing Results 5.2 Dielectric Withstanding Voltage Insulation Resistance Temperature Rise Treatment Mating Force Unmating Force Treatment 75003 Plug Assembly 75005 Recp Assembly REVISION: ECR/ECN INFORMATION: UCP2003-2204 EC No: B DATE: 2003 / DOCUMENT NUMBER: TS-75005-001 TEST SUMMARY Sequence A Treatment Requirement ...

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HIGH SPEED MEZZANINE Treatment Requirement Board Thickness # of Pairs EIA 364 Test Samples 80.07 N MIN Unstressed 50% Fill Unstressed 100% Fill Unstressed 100% Fill Soldered locating Pegs Stressed 100% Fill Reworked Treatment EIA 364 Test Samples 53.37 N ...

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HIGH SPEED MEZZANINE 5.3 High Speed Electrical Testing Results Test Impedance Propagation Delay Near-End Cross Talk NEXT Bandwidth (Insertion Loss) Bandwidth (Return Loss) Note: 1) All Performance Data includes systems effects including via’s and transmission line loss ...

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HIGH SPEED MEZZANINE Impedance Pre and Post FMG Impedance Pre and Post FMG HS Mez Pair TDR @ 77 ps 10/ Mez Pair TDR @ 77 ps 10/ Mez 12 ...

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... EC No: B DATE: 2003 / DOCUMENT NUMBER: TS-75005-001 TEST SUMMARY EIA Sequence 1 Typical 75003 Solder Joint EIA Sequence 2 Typical 75003 Solder Joint TITLE: TEST SUMMARY FOR THE HIGH SPEED MEZZANINE BOARD TO BOARD CONNECTOR SYSTEM CREATED / REVISED BY: Ken Stiles CHECKED BY: APPROVED BY: Ken Stiles Manny Banakis TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V ...

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... UCP2003-2204 B DATE: 2003 / DOCUMENT NUMBER: TS-75005-001 TEST SUMMARY EIA Sequence 3 Typical 75003 Solder Joint EIA Sequence 4 Typical 75003 Solder Joint TITLE: TEST SUMMARY FOR THE HIGH SPEED MEZZANINE BOARD TO BOARD CONNECTOR SYSTEM CREATED / REVISED BY: Ken Stiles CHECKED BY: APPROVED BY: Ken Stiles Manny Banakis TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V ...