FX10B-120S/12-SV(21) Hirose Electric Co Ltd, FX10B-120S/12-SV(21) Datasheet - Page 10
![CONN RECEPT 120POS W/O POST SMD](/photos/1/75/17549/fx10b-120s_12-sv_sml.jpg)
FX10B-120S/12-SV(21)
Manufacturer Part Number
FX10B-120S/12-SV(21)
Description
CONN RECEPT 120POS W/O POST SMD
Manufacturer
Hirose Electric Co Ltd
Series
FX10r
Datasheet
1.FX10B-80P8-SV191.pdf
(26 pages)
Specifications of FX10B-120S/12-SV(21)
Connector Type
Receptacle, Center Strip Contacts
Number Of Positions
120
Pitch
0.020" (0.50mm)
Number Of Rows
2
Mounting Type
Surface Mount
Features
Ground Plate, Solder Retention
Contact Finish
Gold
Contact Finish Thickness
3.9µin (0.10µm)
Mated Stacking Heights
4mm, 5mm
Height Above Board
0.126" (3.20mm)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
H2474TR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
FX10B-120S/12-SV(21)
Manufacturer:
Hirose Electric Co Ltd
Quantity:
12 000
B
B
B
1. Allowable Creepage Dimensions at Time of Mating
2. Retension of Boards
3. Solder Repair
4. Miscellaneous
Recommended Temperature Profile
Washing Conditions
Connector Handling Precautions
Organic Solvent Washing
Water Type Washing
When using water type cleaning agents (e.g., terpene, and alkali saponifiers), select the cleaning agent based on the
documentation issued by the various manufacturers of cleaning agents which describes the effects on metals and resins.
Be careful that parts are not left with moisture remaining on them.
Washing Precautions
Residual flux or cleaning agent on the contacts when washing with organic solvents or water type cleaners can give rise to the
deterioration of electrical performance. In this regard it is important to check whether a thorough washing has been performed.
The effective mating length of this product is 1.1 mm for the signal portion and 1 mm for the ground portion. The creepage of the
header and receptacle at the time of mating should be within 0.5 mm of the completely mating condition.
Avoid the support of boards by connectors alone and adopt a locking measure that does not rely on the connectors.
Flux may rise as far as the contact portion of the connector depending on the flux coating and other factors at the time of repair.
This will cause poor contact reliability; therefore, before use, the aforementioned washing conditions should be taken into
consideration prior to connector washing.
·
·
Note that excessive twisting while inserting or withdrawing connectors will cause damage.
The shade of the molded items may vary somewhat depending on the manufacturing lot; however, this does not affect performance.
IPA
(Isopropyl alcohol)
HCFC
(Hydrochlorofluorocarbon)
Solvent
Room temperature washing Heated washing
Yes
Yes
FX10 Series 0.5mm Pitch Connectors with Ground Plate for Board-to-Board Connections
Yes
Yes
HRS test Conditions
Test board Glass epoxy 161mm
Solder method
Solder composition
Metal mask
Reflow cycles
The temperature profile is based on the above conditions.
In individual applications the actual temperature may vary,
depending on solder paste type,
volume/thickness and board size/thickness. Consult your
solder paste and equipment manufacturer for specific
recommendations.
:Reflow
:Paste,
:0.15mm thick
:2 cycles
96.5%Sn/3%Ag/0.5%Cu
A221