FX6-50P-0.8SV2 Hirose Electric Co Ltd, FX6-50P-0.8SV2 Datasheet - Page 13
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FX6-50P-0.8SV2
Manufacturer Part Number
FX6-50P-0.8SV2
Description
CONN HEADER 50POS .8MM SMD GOLD
Manufacturer
Hirose Electric Co Ltd
Series
FX6r
Datasheet
1.FX6-20P-0.8SV71.pdf
(13 pages)
Specifications of FX6-50P-0.8SV2
Connector Type
Header, Outer Shroud Contacts
Number Of Positions
50
Pitch
0.031" (0.80mm)
Number Of Rows
2
Mounting Type
Surface Mount
Features
Board Guide
Contact Finish
Gold
Mated Stacking Heights
7mm, 9mm
Height Above Board
0.275" (7.00mm)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Contact Finish Thickness
-
Other names
*FX6-50P-0.8SV2
H2422
H2422
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
FX6-50P-0.8SV2
Manufacturer:
Hirose Electric Co Ltd
Quantity:
12 000
Company:
Part Number:
FX6-50P-0.8SV2(22)
Manufacturer:
HRS
Quantity:
509
Company:
Part Number:
FX6-50P-0.8SV2(71)
Manufacturer:
Hirose Electric Co Ltd
Quantity:
12 000
Company:
Part Number:
FX6-50P-0.8SV2(92)
Manufacturer:
Hirose Electric Co Ltd
Quantity:
12 000
Company:
Part Number:
FX6-50P-0.8SV2(93)
Manufacturer:
Hirose Electric Co Ltd
Quantity:
12 000
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
BPrecautions
1. Tolerance Clearance on Mating Side
2. Mounting Temperature Profile (Reference)
3. Board to Board Size
The effective contact length of the product is set to 1.7mm. Please use the products as to set the clearance within 1.0mm
between the header and the receptacle in the mating process.
The board to board size of the male/female connector shown in the application pattern doesn't include the solder paste
thickness. Thus, after the connector is mounted on the board, consider that the board to board size will be widened in
proportion to the solder paste thickness.
(ç)
260
240
220
200
180
160
140
0
150ç
Pre-heating time
(150 to 200ç)
90 to 120s
Time (Second)
200ç
Soldering Time
(220ç min.)
(MAX250ç)
MAX 60s
220ç
HRS test conditions
Test boardGlass epoxy 110mm∞55mm∞1.6mm thick
Solder method
Solder composition
Metal mask
Reflow cycles
The temperature profile is based on the above
conditions.
In individual applications the actual temperature may
vary, depending on solder paste type,
volume/thickness and board size/thickness. Consult
your solder paste and equipment manufacturer for
specific recommendations.
FX6 Series●0.8mm Pitch Stacking Height 5 to 9mm Connector
:Reflow
:Paste,
: 0.15mm thick
: 2 cycles
96.5%Sn/3%Ag/0.5%Cu
A155