DF23C-30DP-0.5V(51) Hirose Electric Co Ltd, DF23C-30DP-0.5V(51) Datasheet - Page 7

• Manufacturer Part Number: DF23C-30DP-0.5V(51)
• Description: CONN PLUG 30POS DUAL 0.5MM SMD
• Manufacturer: Hirose Electric Co Ltd
• Series: DF23r

Specifications of DF23C-30DP-0.5V(51)

• Connector Type: Plug, Outer Shroud Contacts
• Number Of Positions: 30
• Pitch: 0.020" (0.50mm)
• Number Of Rows: 2
• Mounting Type: Surface Mount
• Contact Finish: Gold
• Mated Stacking Heights: 1.5mm
• Height Above Board: 0.047" (1.20mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Contact Finish Thickness: -
• Other names: *DF23C-30DP-0.5V(51); DF23C-30DP-0.5V51

A244
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
DF23 Series●0.5mm Pitch Low-Profile Board-to-Board/Board-to-FPC Connectors
BUsage Precautions
1.Recommended
2.Recommended Manual
3.Recommended Screen
4.Board Warping
5.Cleaning Conditions
6.Use and handling precautions.
Temperature Profile
Temperature
Soldering Conditions
Thickness and Open Area
Ratio (Pattern Area Ratio)
Note 1: Up to 2 cycles of Reflow soldering are possible under the same conditions, provided that there is a return
Note 2: The temperature profile indicates the board surface temperature at the point of contacts with the
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■
■
■
■
Temperature: 290
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Maximum of 0.03 mm at the connector center section, with both ends of the connector as reference points.
Refer to the "Nylon Connector Use Handbook."
When manually handling the connectors avoid touching any portion of exposed terminal leads.
This may cause deformation and lead to difficulties with placement and soldering on the PCB.
When mating/un-mating do not use excessive force or lifting of one side only.
Thickness : 0.12 mm
Open Area ratio: 80%
to normal temperature between the first and second cycle.
connector terminals.
Room temperature
ç±
10
Temperature (ç)
ç
, Soldering time: within 2 sec.
250
200
150
100
50
0
150ç
50
90~120sec
100
Preheating
180ç
150
250ç
220ç
200
60sec max
Soldering
250
Time (sec.)
300