SEAM-20-02.0-S-08-2-A Samtec Inc, SEAM-20-02.0-S-08-2-A Datasheet - Page 2

• Manufacturer Part Number: SEAM-20-02.0-S-08-2-A
• Description: CONN SNGL-END ARRAY MALE 160POS
• Manufacturer: Samtec Inc
• Series: SEARAY™ SEAMr

Specifications of SEAM-20-02.0-S-08-2-A

• Connector Type: High Density Array, Male
• Number Of Positions: 160
• Pitch: 0.050" (1.27mm)
• Number Of Rows: 8
• Mounting Type: Surface Mount
• Features: Board Guide
• Contact Finish: Gold
• Contact Finish Thickness: 30µin (0.76µm)
• Mated Stacking Heights: 7mm, 8mm, 8.5mm
• Height Above Board: 0.181" (4.60mm)
• Pitch Spacing: 1.27mm
• No. Of Contacts: 160
• Gender: Plug
• Contact Plating: Gold
• Row Pitch: 1.27mm
• No. Of Rows: 8
• Contact Termination: Surface Mount Vertical
• Contact Material: Copper Alloy
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: SAM8016

For complete specifi cations and
recommended PCB layouts see
www.samtec.com?SEAM
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Current Rating:
Testing Now!
Operating Temp Range:
-55°C to +125°C
Plating:
Au or Sn over 50µ" (1,27µm) Ni
Contact Resistance:
19 mΩ max
Working Voltage:
260 VAC
RoHS Compliant:
Y es
Lead-Free Solderable:
Yes
Mates with:
SEAF-RA-GP
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?SEAM-GP
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Current Rating:
2.7 A
Operating Temp Range:
-55°C to +125°C
Plating:
Au over 50µ" (1,27µm) Ni
Contact Resistance:
5.5 mΩ
Working Voltage:
240 VAC
Mated Cycles:
100
RoHS Compliant:
Y es
Lead-Free Solderable:
Yes
Note: Some sizes, styles and
options are non-standard,
non-returnable.
HI-DENSITY RIGHT ANGLE OPEN PIN FIELD
Mates with:
SEAF-RA, SADL, SEAF
Note: Some sizes, styles and
options are non-standard,
non-returnable.
F-211
Polyimide fi lm Pick & Place Pad.
SPECIFICATIONS
SPECIFICATIONS
(1,27mm) .050"
SEAM-RA, SEAM-GP SERIES
ALSO AVAILABLE
Tin-Lead Solder Charge.
Call Samtec.
SEAM
SEAM
(4,60)
.181
NUMBER PINS
(1,27)
PER ROW
.050
–20
–30
–40
–50
– 20, – 30,
– 20, – 30,
–40, –50
–40, –50
Without –GP= No. of positions x (1,27) .050 + (11,18) 0.44
–GP= No. of positions x (1,27) .050 + (19,56) 0.77
PER ROW
PER ROW
No. of positions x (1,27) .050 + (19,46) .766
(3,05) .120 DIA
NO. PINS
NO. PINS
(38,94) 1.533
(51,64) 2.033
(64,34) 2.533
(77,04) 3.033
(1,12) .044 DIA
A
(1,27) .050 + (3,58) .141
(1,27)
.050
No. of positions x
WWW.SAMTEC.COM
SEAM–20–01–L–06–2–RA–GP–TR
Note: Other Gold plating
options available.
Contact Samtec.
Note: Other Gold plating
options available.
Contact Samtec.
01
02.0
Matte Tin on solder tail
A
(1,27)
Gold on contact area,
.050
Matte Tin on solder tail
Gold on contact area,
= 10µ" (0,25µm)
= 10µ" (0,25µm)
.034 DIA
(0,86)
–L
(3,05).120 DIA
PLATING
– L
OPTION
PLATING
OPTION
(0,51)
.020
SQ
(8,13)
.320
(1,02)
.040
NO. OF
=Eight Rows
ROWS
=Four Rows
=Ten Rows
=Six Rows
– 04
– 06
– 08
=Eight
– 10
=Four
Rows
Rows
Rows
Rows
NO. OF
=Ten
(12,65)
=Six
ROWS
(5,36)
– 04
– 06
– 08
– 10
.498
.211
(5,54)
.218
(1,60)
.063
2
(8,13)
= Lead-Free
.320
2
95.5% Sn/
= Lead-Free Tin Alloy
Tin Alloy
3.8% Ag/
0.7% Cu
Charge
Solder
SEAM–30–02.0–L–04–2–A–GP–K–TR
– 2
95.5% Sn/3.8%
Solder Charge
(19,30) .760
Ag/0.7% Cu
RA
A
– 2
01
06
(12,32)
ALSO AVAILABLE
.485
Extended Guide Post.
GP
OPTION
Call Samtec.
• Guide posts
= Guide
– GP
(0,64)
Post
.025
(7,91)
.312
(Not available
K
=Tape & Reel
= Polyimide
fi lm Pick &
Place Pad
positions)
– TR
with 50
– K
=Tape &
– TR
Reel
TR
TR