2NBS16-TJ1-103 Bourns Inc., 2NBS16-TJ1-103 Datasheet - Page 2

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2NBS16-TJ1-103

Manufacturer Part Number
2NBS16-TJ1-103
Description
RESNET 16POS ISOLAT 10K OHM SOIC
Manufacturer
Bourns Inc.
Series
2NBSr
Datasheet

Specifications of 2NBS16-TJ1-103

Resistance (ohms)
10K
Number Of Resistors
8
Circuit Type
Isolated
Temperature Coefficient
±100ppm/°C
Tolerance
±5%
Power Per Element
100mW
Number Of Pins
16
Package / Case
16-SOIC (0.154", 3.90mm Width)
Size / Dimension
0.393" L x 0.157" W (9.98mm x 3.99mm)
Height
0.069" (1.75mm)
Mounting Type
Surface Mount
Operating Temperature
-55°C ~ 125°C
Other names
2NBS16-TG1-103
Q941298
Mechanical Characteristics
QSOP Package Dimensions
Thin Film on Silicon 2QSP / 2NBS -XX1 Isolated Resistors
Governing dimensions are in mm. Dimensions in
parentheses are in inches and are approximate.
JEDEC Reference Number MO-137.
(.150 - .157)
3.81 - 3.99
2QSP16
2QSP20
2QSP24
2QSP28
Model
PIN 1
0-8 °
(.053 - .069)
1.35 - 1.75
(.004 - .010)
.10 - .25
(.228 - .244)
5.80 - 6.20
4.80 - 4.98 (.189 - .196)
8.56 - 8.74 (.337 - .344)
8.56 - 8.74 (.337 - .344)
9.80 - 9.98 (.386 - .393)
(.025)
.635
A
(.008 - .012)
TYP.
.21 - .31
A
(.007 - .010)
(.016 - .050)
.41 - 1.27
.19 - .25
Narrow-Body SOIC Package Dimensions
Customers should verify actual device performance in their specific applications.
Governing dimensions are in mm. Dimensions in
parentheses are in inches and are approximate.
JEDEC Reference Number MS-012.
(.150 - .157)
3.81 - 3.99
2NBS08
2NBS14
2NBS16
Model
PIN 1
0-8 °
(.053 - .069)
1.35 - 1.75
(.004 - .010)
.10 - .25
(.228 - .244)
4.80 - 4.98 (.189 - .196)
8.56 - 8.74 (.337 - .344)
9.80 - 9.98 (.386 - .393)
Specifications are subject to change without notice.
5.80 - 6.20
(.050)
(.014 - .018)
1.27
0.36 - 0.46
A
TYP.
A
(.007 - .010)
(.016 - .050)
.41 - 1.27
.19 - .25

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