2QSP16-TJ2-101 Bourns Inc., 2QSP16-TJ2-101 Datasheet - Page 2
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2QSP16-TJ2-101
Manufacturer Part Number
2QSP16-TJ2-101
Description
RESNET 100 OHM16PIN BUSSED QSOP
Manufacturer
Bourns Inc.
Series
2QSPr
Datasheet
1.2QSP16-TG2-103.pdf
(4 pages)
Specifications of 2QSP16-TJ2-101
Resistance (ohms)
100
Number Of Resistors
15
Circuit Type
Bussed
Temperature Coefficient
±100ppm/°C
Tolerance
±5%
Power Per Element
100mW
Number Of Pins
16
Package / Case
16-LSSOP (0.154", 3.91mm Width)
Size / Dimension
0.196" L x 0.157" W (4.98mm x 3.99mm)
Height
0.069" (1.75mm)
Mounting Type
Surface Mount
Operating Temperature
-55°C ~ 125°C
Mechanical Characteristics
QSOP Package Dimensions
Thin Film on Silicon 2QSP / 2NBS -XX2 Bussed Resistors
Governing dimensions are in mm. Dimensions in
parentheses are in inches and are approximate.
JEDEC Reference Number MO-137.
(.150 - .157)
3.81 - 3.99
2QSP16
2QSP20
2QSP24
2QSP28
Model
PIN 1
0-8 °
(.053 - .069)
1.35 - 1.75
(.004 - .010)
.10 - .25
(.228 - .244)
5.80 - 6.20
4.80 - 4.98 (.189 - .196)
8.56 - 8.74 (.337 - .344)
8.56 - 8.74 (.337 - .344)
9.80 - 9.98 (.386 - .393)
(.025)
.635
A
(.008 - .012)
TYP.
.21 - .31
A
(.007 - .010)
(.016 - .050)
.41 - 1.27
.19 - .25
Narrow-Body SOIC Package Dimensions
Customers should verify actual device performance in their specific applications.
Governing dimensions are in mm. Dimensions in
parentheses are in inches and are approximate.
JEDEC Reference Number MS-012.
(.150 - .157)
3.81 - 3.99
2NBS08
2NBS14
2NBS16
Model
PIN 1
0-8 °
(.053 - .069)
1.35 - 1.75
(.004 - .010)
.10 - .25
(.228 - .244)
4.80 - 4.98 (.189 - .196)
8.56 - 8.74 (.337 - .344)
9.80 - 9.98 (.386 - .393)
Specifications are subject to change without notice.
5.80 - 6.20
(.050)
(.014 - .018)
1.27
0.36 - 0.46
A
TYP.
A
(.007 - .010)
(.016 - .050)
.41 - 1.27
.19 - .25