13192DSK-BDM-A00 Freescale Semiconductor, 13192DSK-BDM-A00 Datasheet - Page 23

• Manufacturer Part Number: 13192DSK-BDM-A00
• Description: KIT STARTER MC13191/92 W/CABLE
• Manufacturer: Freescale Semiconductor
• Type: 802.15.4/Zigbeer

Specifications of 13192DSK-BDM-A00

• Contents: Hardware, Software, Documentation and USB Multilink
• Wireless Frequency: 2.4 GHz
• Interface Type: SPI
• Modulation: DSSS OQPSK
• Security: 128 bit AES
• For Use With/related Products: MC13191, MC13192
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

9
Freescale Semiconductor
32X
2X
EXPOSED DIE
ATTACH PAD
0.065
0.015
Packaging Information
0.1
0.1
32X
3.25
2.95
PREFERRED CORNER CONFIGURATION
BACKSIDE PIN 1 INDEX OPTION
C
C
0.5
0.3
A
A
B
5
B
DETAIL M
24
17
DETAIL N
4
(0.25)
25
16
PIN 1
INDEX AREA
0.1
(1.73)
VIEW M-M
3.25
2.95
5
DETAIL T
Figure 12. Outline Dimensions for QFN-32, 5x5 mm
C
(45 ) 5
A
B
9
32
32X
8
1
2X
N
MC13192 Technical Data, Rev. 3.3
0.475
0.425
0.30
0.18
0.1
0.5
0.05
0.1
DETAIL M
PIN 1 INDEX
R
(Case 1311-03, Issue E)
0.25
0.15
28X
C
M
M
0.25
CORNER CONFIGURATION OPTION
BACKSIDE PIN 1 INDEX OPTION
G
C
C
0.60
0.24
A
DETAIL M
DETAIL N
M
B
1.6
1.5
M
4
BACKSIDE
PIN 1 INDEX
0.60
0.24
NOTES:
1.0
0.8
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONING AND TOLERANCING PER ASME
3. THE COMPLETE JEDEC DESIGNATOR FOR THIS
4. CORNER CHAMFER MAY NOT BE PRESENT.
5. COPLANARITY APPLIES TO LEADS, CORNER
6. FOR ANVIL SINGULATED QFN PACKAGES,
(0.25)
0.05
0.00
PACKAGE IS: HF-PQFP-N.
DIMENSIONS OF OPTIONAL FEATURES ARE FOR
REFERENCE ONLY.
LEADS, AND DIE ATTACH PAD.
MAXIMUM DRAFT ANGLE IS 12°.
Y14.5M, 1994.
1.00
0.75
2X
0.39
0.31
PREFERRED BACKSIDE PIN 1 INDEX
0.217
0.137
PREFERRED BACKSIDE PIN 1 INDEX
VIEW ROTATED 90° CLOCKWISE
BACKSIDE PIN 1 INDEX OPTION
(0.5)
DETAIL M
DETAIL G
DETAIL T
DETAIL S
(0.25)
DETAIL S
2X
Packaging Information
(90 )
0.1
0.0
C
0.217
0.137
0.1
0.05
(0.1)
SEATING PLANE
C
C
5
23