SKY65116-21 Skyworks Solutions Inc, SKY65116-21 Datasheet - Page 10

• Manufacturer Part Number: SKY65116-21
• Description: IC AMP LINEAR 390-500MHZ 12-MCM
• Manufacturer: Skyworks Solutions Inc

Specifications of SKY65116-21

• Current - Supply: 1.3A
• Frequency: 390MHz ~ 500MHz
• Gain: 35dB
• Noise Figure: 6dB
• P1db: 32.5dBm
• Package / Case: 12-MCM
• Rf Type: GSM, NMT, TETRA, UHF, WLL
• Voltage - Supply: 4.5V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Test Frequency: -
• Other names: 863-1072-2

Data Sheet • SKY65116
Application Circuit
Center attachment pad must have a low inductance and low thermal resistance connection to
the customer’s printed circuit board ground plane.
10
Pin Assignments
Pin #
10
11
12
1
2
3
4
5
6
7
8
9
Reference
RF in
Voltage
February 18, 2009 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200510 Rev. H
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
V
CC
RFOUT
Name
GND
RFIN
GND
V
GND
GND
GND
GND
V
V
V
CC1
CC2
CNT
REF
50 Ω transmission
10 µF
10 µF
C7
C3
Ground
RF input
Ground
Stage 1 collector voltage
Ground
Ground
Ground
RF output
Ground
Stage 2 collector voltage
PA on/off coltrol voltage
Bias reference voltage
line
0.01 µF
description
C8
1
3
2
C6
0.01 µF
GND
RFIN
GND
12
4
11
5
Evaluation Board Description
The Skyworks SKY65116 evaluation board is used to test the
performance of the SKY65116 power amplifier module. The
following design considerations are general in nature and
must be followed regardless of final use or configuration.
1. Paths to ground should be made as short as possible.
2. The ground pad of the SKY65116 power amplifier module has
3. Two external output bypass capacitors (0.01 µF and 10 µF) are
4. V
NOTE: Junction temperature (T
0.01 µF
special electrical and thermal grounding requirements. This pad
is the main thermal conduit for heat dissipation. Since the circuit
board acts as the heat sink, it must shunt as much heat as pos-
sible from the amplifiers. As such, design the connection to the
ground pad to dissipate the maximum wattage produced to the
circuit. Multiple vias to the grounding layer are required.
required on the V
itor values are also required on the V
and on the V
be placed in parallel between the supply line and ground.
the supply.
CC1
10
6
C5
poor connection to the slug and ground. This reduces the
lifetime of the device.
(pin 4) and V
RFOUT
0.01 µF
GND
GND
REF
C4
input (pin 12). Each of these capacitors should
CC1
9
8
7
CC2
(pin 4) supply input. The same two capac-
(pin 10) may be connected together at
C2
10 µF
50 Ω transmission
J
) of the device increases with a
line
C1
10 µF
CC2
PA Control
Voltage
V
CC
(pin 10) supply input
RF out