MGA-425P8-TR1 Avago Technologies US Inc., MGA-425P8-TR1 Datasheet - Page 2

IC PWR AMP PHEMT GAAS ENH 8-PLCC

MGA-425P8-TR1

Manufacturer Part Number
MGA-425P8-TR1
Description
IC PWR AMP PHEMT GAAS ENH 8-PLCC
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of MGA-425P8-TR1

Gain
14.5dB ~ 17.5dB
Current - Supply
51mA ~ 65mA
Frequency
2GHz ~ 10GHz
Noise Figure
1.7dB
P1db
18.25dBm ~ 20.3dBm
Package / Case
8-LPCC
Rf Type
ISM, 802.11a/Wi-Fi
Test Frequency
5.25GHz
Voltage - Supply
3.3V
Frequency Range
2GHz To 10GHz
Noise Figure Typ
1.7dB
Power Dissipation Pd
500mW
Supply Current
58mA
Supply Voltage Range
3.3V
Rf Ic Case Style
LPCC
No. Of Pins
8
Manufacturer's Type
Power Amplifier
Number Of Channels
1
Frequency (max)
10GHz
Operating Supply Voltage (typ)
3.3V
Package Type
LPCC
Mounting
Surface Mount
Pin Count
8
Noise Figure (typ)
1.7@5250MHzdB
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MGA-425P8-TR1
Manufacturer:
AVAGO
Quantity:
932
Part Number:
MGA-425P8-TR1
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Part Number:
MGA-425P8-TR1G
Manufacturer:
AVAGO
Quantity:
932
MGA-425P8 Absolute Maximum Ratings
V
I
P
P
T
T
θ
Product Consistency Distribution Charts at 5.25 GHz, 3.3V RBias = 680Ω
150
120
240
200
160
120
2
Symbol
DS
Figure 1. OIP3;
LSL = 29 dBm, Nominal = 32.9 dBm.
Figure 4. P1dB;
LSL = 18.25 dBm, Nominal = 20.3 dBm.
90
60
30
80
40
diss
in
CH
STG
ch_b
DS
0
0
18.3
max.
29
19.3
31
OIP3 (dBm)
P1dB (dBm)
Parameter
Drain – Supply Voltage
Drain Current
Total Power Dissipation
RF Input Power
Channel Temperature
Storage Temperature
Thermal Resistance
20.3
33
21.3
35
[2]
[4]
22.3
37
[2]
[1]
[3]
180
150
120
180
150
120
Figure 2. GAIN;
LSL = 14.5 dB, Nominal = 16 dB, USL= 17.5 dB.
Figure 5. PAE;
LSL = 33.5 %, Nominal = 47 %.
90
60
30
90
60
30
0
0
14.8
34
Units
V
A
W
dBm
°C
°C
°C/W
15.3
39
15.8
44
GAIN (dB)
PAE (%)
16.3
[5, 6]
49
Absolute
Maximum
5
100
0.5
13
150
-65 to 150
34.2
16.8
54
17.3
59
Notes:
1. Operation of this device above any
2. Assuming DC quiescent conditions.
3. Board (package belly) temperature T
4. Channel-to-board thermal resistance mea-
Notes:
5. Distribution data sample size is 500
6. Measurements are made on production
250
200
150
100
manent damage.
25°C. Derate 29 mW/°C for T
sured using 150°C Liquid Crystal Measure-
ment method.
Figure 3. IDS;
LSL = 51 mA, Nominal = 58 mA, USL = 65 mA.
samples taken from 3 different wafers and
3 different lots. Future wafers allocated
to this product may have nominal values
anywhere between the upper and lower
limits.
test board, which represents a trade-off
between optimal OIP3, P1dB, Gain and
VSWR. Circuit losses have been de-embed-
ded from actual measurements.
one of these parameters may cause per-
50
0
51
53
55
IDS (mA)
57
59
B
61
> 133 °C.
63
B
is
65

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