UPC2746TB-E3 CEL, UPC2746TB-E3 Datasheet - Page 17

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UPC2746TB-E3

Manufacturer Part Number
UPC2746TB-E3
Description
MMIC AMP 1.5GHZ SOT-363
Manufacturer
CEL
Datasheet

Specifications of UPC2746TB-E3

Current - Supply
7.5mA
Frequency
100MHz ~ 1.5GHz
Gain
19dB
Noise Figure
4dB
Package / Case
SC-70-6, SC-88, SOT-363
Rf Type
General Purpose
Voltage - Supply
1.8V ~ 3.3V
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
P1db
-
Test Frequency
-
Other names
UPC2746TB-E3TR
UPC2746TB-TR
UPC2746TBTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
UPC2746TB-E3
Manufacturer:
MITSUMI
Quantity:
1 860
Part Number:
UPC2746TB-E3
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Part Number:
UPC2746TB-E3(KB)
Manufacturer:
NEC
Quantity:
3 089
Part Number:
UPC2746TB-E3-A
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
(3) The bypass capacitor should be attached to the V
(4) The DC cut capacitor must be attached to input pin and output pin.
RECOMMENDED SOLDERING CONDITIONS
methods and conditions other than those recommended below, contact your nearby sales office.
17
Infrared Reflow
VPS
Wave Soldering
Partial Heating
This product should be soldered and mounted under the following recommended conditions.
Caution Do not use different soldering methods together (except for partial heating).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
Soldering Method
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (package surface temperature)
Time at temperature of 200°C or higher
Preheating time at 120 to 150°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (molten solder temperature)
Time at peak temperature
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (pin temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
Data Sheet PU10443EJ1V0DS
Soldering Conditions
CC
pin.
: 260°C or below
: 10 seconds or less
: 60 seconds or less
: 120±30 seconds
: 3 times
: 0.2%(Wt.) or below
: 215°C or below
: 25 to 40 seconds
: 30 to 60 seconds
: 3 times
: 0.2%(Wt.) or below
: 260°C or below
: 10 seconds or less
: 1 time
: 0.2%(Wt.) or below
: 350°C or below
: 3 seconds or less
: 0.2%(Wt.) or below
µ
PC2745TB,
Condition Symbol
µ
WS260
VP215
HS350
For soldering
IR260
PC2746TB

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