A09-HSM-7 Digi International/Maxstream, A09-HSM-7 Datasheet - Page 64
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A09-HSM-7
Manufacturer Part Number
A09-HSM-7
Description
ANT 900MHZ 7" STRAIGHT W/RPSMA
Manufacturer
Digi International/Maxstream
Specifications of A09-HSM-7
Antenna Type
Whip: 1/2 Wave
Number Of Bands
1
Frequency
915MHz (902MHz ~ 928MHz)
Vswr
2
Gain
2dBi
Termination
RP-SMA
Mounting Type
Connector
Height (max)
7.0" (177.8mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
9XTend™ OEM RF Module ‐ Product Manual v2.x4x [2007.01.04]
Interfacing Protocols
RS-232 Operation
DIP Switch Settings and Serial Port Connections
The XTend Module Assembly (XTend OEM RF Module mounted to the XTIB-R Interface Board) sup-
ports the following interfacing protocols:
Figure B‐11.
RS‐232 DIP Switch Settings
DIP Switch settings are read and applied
only while powering‐on.
Table B‐04. RS‐232 Signals and their implementations on the XTend Module Assembly
* ‘X‐CTU’ is software that can be used to configure the module. The software includes a naming convention
where ʺGPIʺ stands for ‘General Purpose Input’ and ʺGPOʺ for ‘General Purpose Output’.
© 2007 MaxStream, Inc.
DB-9 Pin
• RS-232
• RS-485 (2-wire) Half-Duplex
• RS-485 (4-wire) and RS-422
1
2
3
4
5
6
7
8
9
(Low‐asserted signals are distinguished by horizontal line over pin name.)
RTS / CMD
RS-232
Name
DCD
RXD
DTR
GND
DSR
TXD
CTS
RI
X-CTU
Name*
GPO2
GPO2
GPO1
GPI2
GPI1
DO
DI
-
-
Data-Terminal-Ready
Data-Carrier-Detect
Request-to-Send /
Transmitted Data
Command Mode
Data-Set-Ready
Received Data
Description
Ground Signal
Clear-to-Send
Ring Indicator
Figure B‐12.
Pins used on the female RS‐232 (DB‐9) Serial Connector
Serial data entering into the module assembly (from host)
Provides RTS flow control or enables Command Mode
Optional power input that is connected internally to the
Can enable Power-Down on the module assembly
Serial data exiting the module assembly (to host)
positive lead of the front power connector
Connected to DSR (pin6 of DB-9)
Connected to DCD (pin1 of DB-9)
Provides CTS flow control
Implementation
Appendix B: Development Guide
Ground
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