MAX4003EUA Maxim Integrated Products, MAX4003EUA Datasheet - Page 9

• Manufacturer Part Number: MAX4003EUA
• Description: IC LOG AMP RF DETECT 45DB 8-MSOP
• Manufacturer: Maxim Integrated Products

Specifications of MAX4003EUA

• Frequency: 100MHz ~ 2.5GHz
• Rf Type: Cellular, TDMA, CDMA, GPRS, GSM
• Input Range: -45dBm ~ 0dBm
• Voltage - Supply: 2.7 V ~ 5 V
• Current - Supply: 5.9mA
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Accuracy: -
• Other names: Q1522404

fier of interest. This requires full consideration of the
intricacies of the PA detector control function. The
worst-case condition, where the PA output is smallest
(gain function is steepest), should be used because the
PA control function is nonlinear. An additional zero can
be added to improve loop dynamics by placing a resis-
tor in series with C
Although the input level of the MAX4003 is specified in
dBm, the logarithmic amplifier actually responds to rec-
tified voltage signals rather than a true RMS power. It is
important to realize that input signals with identical root-
mean-square power but with unique waveforms result
in different logarithmic outputs.
Differing signal waveforms result in either an upward or
downward shift in the logarithmic intercept. However,
the logarithmic slope remains the same.
As with any RF circuit, the MAX4003 circuit layout
affects performance. To ensure maximum power trans-
fer between 50
able matching networks should be implemented. The
V
the device with multiple vias connecting the capacitor
to the ground plane.
CC
input should be bypassed as close as possible to
Pin Configurations (continued)
TOP VIEW
SHDN
CLPF
RFIN
GND
sources and the MAX4003 input, suit-
CLPF
_______________________________________________________________________________________
1
2
4
3
100MHz to 2500MHz, 45dB RF Detector
Waveform Considerations
.
THIN QFN
MAX4003
Layout Considerations
6
8
7
5
V
OUT
N.C.
GND
CC
The UCSP represents a unique package that greatly
reduces board space compared to other packages.
UCSP reliability is integrally linked to the user’s assem-
bly methods, circuit board material, and usage environ-
ment. The user should closely review these areas when
considering use of a UCSP. This form factor may not
perform equally to a packaged product through tradi-
tional mechanical reliability tests. Performance through
operating life test and moisture resistance remains
uncompromised as it is primarily determined by the
wafer fabrication process. Mechanical stress perfor-
mance is a greater consideration for a UCSP. UCSP
solder joint contact integrity must be considered since
the package is attached through direct solder contact
to the user’s PC board. Testing done to characterize
the UCSP reliability performance shows that it can per-
form reliably through environmental stresses. Results of
environmental stress tests and additional usage data
and recommendations are detailed in the UCSP
application note found on Maxim’s website,
www.maxim-ic.com.
TRANSISTOR COUNT: 358
Chip Information
UCSP Reliability
in a UCSP
9