2450DP15E5400E Johanson Technology Inc, 2450DP15E5400E Datasheet - Page 54

• Manufacturer Part Number: 2450DP15E5400E
• Description: DIPLEXER LPF/BPF 2.45/5.4GHZ
• Manufacturer: Johanson Technology Inc

Specifications of 2450DP15E5400E

• Frequency Bands (low / High): 2.4GHz ~ 2.5GHz / 4.9GHz ~ 5.9GHz
• Low Band Attenuation (min / Max Db): 20.00dB / 0.70dB
• High Band Attenuation (min / Max Db): 17.00dB / 1.60dB
• Return Loss (low Band / High Band): 9.5dB / 9.5dB
• Mounting Type: Surface Mount
• Package / Case: 1206 (3216 Metric)
• Return Loss: 9.5dB
• Bandpass Insertion Loss Max: 1.6dB
• Attenuation @ Reject Band Min: 17dB
• Termination Type: SMD
• Rohs Compliant: Yes
• Capacitance: 0µF
• Lead Free Status / RoHS Status: Lead free by exemption / RoHS Compliant
• Other names: 2450DP15E5400; 2450DP15E5400

54
C
Metalized substrates may also be patterned to
customer specifications by chemical etching, abrasive
etching, or pattern plating. Please contact the factory
for other types of metallization configurations other than
a continuous top / bottom plating. Other termination
material thicknesses are available upon request.
ALN
Alumina
Titanate Based
Titanate Based
Titanate Based
Titanate Based
Titanate Based
Titanate Based
Titanate Based
Titanate Based
Titanate Based
Titanate Based
Titanate Based
Titanate Based
Titanate Based
Titanate Based
SUBSTRATE
USTOM
MATERIAL
*
*
S
UBSTRATES
MATERIAL
CODE
W
G
C
K
N
U
R
D
B
Y
F
V
L
X
T
Z
& T
12000
1200
2000
2700
4000
8000
120
160
280
350
600
8.8
9.9
23
37
80
K
HIN
www.johansontechnology.com
www.johansontechnology.com
170 W/M deg K (Th. Cond.)
P120 +/- 30 ppm / deg C
0 +/- 30 ppm / deg C
0 +/- 30 ppm / deg C
0 +/- 30 ppm / deg C
-750 +/- 120 ppm / deg C
-1500 +/- 300 ppm / deg C
-750 +/- 120 ppm / deg C
-750 +/- 120 ppm / deg C
+/- 10% (-55 to +125 C)
+/- 10% (-55 to +125 C)
+/- 10% (-55 to +125 C)
+/- 15% (-55 to +125 C)
+/- 15% (-55 to +125 C)
+22/-56% (+10 to +85 C)
+22/-82% (-30 to +85 C)
F
ILM
TEMPERATURE
COEFFICIENT
P
RODUCTS
Johanson Technology offers a wide range
of dielectrics for use in application specific
environments. These materials are available
both lapped and “as fired” condition as well
as metalized and non-metalized substrates.
Standard substrate sizes range from 0.50” x
0.50” to 1.50” x 1.50”, with larger sizes available
with special order . Dielectrics are available from
0.005” to 0.050” thick.
Note: When metallization is requested on
both top and bottom sides, the metallization
will wrap around the sides as a standard
unless otherwise specified.
TiW / Ni / Cu / Ni / Au
METALIZATION
Non-Metallized
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
TaN / TiW / Au
TEMPERATURE
80Au / 20 Sn
TiW / Ni / Au
TiW / Ni / Sn
OPERATING
TiW / Au
< 0.15% @ 1 MHz
< 0.15% @ 1 MHz
< 0.15% @ 1 MHz
< 0.25% @ 1 MHz
< 0.25% @ 1 MHz
< 0.25% @ 1 MHz
< 1.50% @ 1 MHz
< 2.50% @ 1 kHz
< 2.50% @ 1 kHz
< 2.50% @ 1 kHz
< 2.50% @ 1 kHz
< 2.50% @ 1 kHz
< 4.00% @ 1 kHz
< 4.00% @ 1 kHz
DISSIPATION
FACTOR
CODE
N
V
R
C
E
X
T