STEVAL-TDR005V1 STMicroelectronics, STEVAL-TDR005V1 Datasheet - Page 8
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STEVAL-TDR005V1
Manufacturer Part Number
STEVAL-TDR005V1
Description
BOARD REF DESIGN RF PWR AMP
Manufacturer
STMicroelectronics
Type
Amplifierr
Datasheet
1.STEVAL-TDR005V1.pdf
(11 pages)
Specifications of STEVAL-TDR005V1
Frequency
1.03GHz
Product
Power Management Modules
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
SD2943 mounting recommendations
6
6.1
6.2
8/11
SD2943 mounting recommendations
Mounting recommendations
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Mounting sequence
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Ensure holes in heatsinks are free from burrs;
Minimum depth of tapped holes in heatsinks is 6 mm;
Use 4-40 UNC-2A cheese-head screws with a flat washer to spread the joint pressure;
The minimum flatness of the mounting area is 0.02 mm;
Mounting area roughness should be less than 0.5 µm (micro);
Avoid, as much as possible, use of flux or flux solutions because flux can penetrate
even when hermetically sealed ceramic-capped transistors. Tin and wash the printed-
circuit board BEFORE mounting the power transistors, then solder the transistor leads
without using flux;
Transistor leads may be tinned by dipping them full-length into a solder bath at a
temperature of about 230 °C. No flux should be used during tinning;
Recommended heatsink compounds: WPSII (silicon free) from austerlitz electronics,
340 from down corning etc.
Apply a thin layer of evenly distributed heatsink compound to the flange;
Position the device with flat washers in place;
Tighten the screws until finger tight (0.05 Nm);
Further tighten the screws until the specified torque is reached;
For M174, M177 and M244 type of packages, torque should be minimum 0.6 Nm and
0.75 Nm max.
Doc ID 14845 Rev 2
STEVAL-TDR005V1