MAX2031EVKIT Maxim Integrated Products, MAX2031EVKIT Datasheet - Page 2

• Manufacturer Part Number: MAX2031EVKIT
• Description: EVAL KIT FOR MAX2031
• Manufacturer: Maxim Integrated Products
• Type: Mixerr

Specifications of MAX2031EVKIT

• Frequency: 815MHz ~ 1GHz
• For Use With/related Products: MAX2031
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
V
RF (RF is DC shorted to GND through a balun)..................50mA
LO1, LO2 to GND ..................................................-0.3V to +0.3V
IF+, IF- to GND ...........................................-0.3V to (V
TAP to GND ...........................................................-0.3V to +1.4V
LOSEL to GND ...........................................-0.3V to (V
LOBIAS to GND..........................................-0.3V to (V
RF, LO1, LO2 Input Power (Note 1) ...............................+20dBm
RECOMMENDED AC OPERATING CONDITIONS
High-Linearity, 650MHz to 1000MHz Upconversion/
Downconversion Mixer with LO Buffer/Switch
DC ELECTRICAL CHARACTERISTICS
( Typical Application Circuit , V
IF balun. Typical values are at V
Note 1: Maximum, reliable, continuous input power applied to the RF and IF port of this device is +12dBm from a 50Ω source.
Note 2: Based on junction temperature T
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
Note 4: Junction temperature T
Note 5: T
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
Supply Voltage
Supply Current
LOSEL Input-Logic Low
LOSEL Input-Logic High
RF Frequency
LO Frequency
IF Frequency
LO Drive Level
CC
_______________________________________________________________________________________
to GND ...........................................................-0.3V to +5.5V
pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction
temperature must not exceed +150°C.
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
known. The junction temperature must not exceed +150°C.
C
PARAMETER
is the temperature on the exposed pad of the package. T
PARAMETER
CC
CC
J
= 4.75V to 5.25V, no RF signals applied, T
= T
= 5V, T
A
SYMBOL
+ (θ
SYMBOL
P
f
f
J
f
C
RF
LO
IF
LO
JA
V
= T
I
V
V
= +25°C, unless otherwise noted.)
CC
CC
IH
IL
x V
C
+ (θ
CC
C om p onents tuned for the 700M H z b and
( Tab l e 1) , C 1 = 7p F, C 5 = 3.3p F ( N otes 6, 7)
C om p onents tuned for the 800M H z/900M H z
cel l ul ar b and ( Tab l e 1) , C 1 = 82p F,
C 5 = 2.0p F ( N ote 6)
(Notes 6, 7)
IF frequency range depends on external IF
transformer selection
(Note 6)
x I
JC
CC
CC
CC
CC
x V
+ 0.3V)
+ 0.3V)
+ 0.3V)
). This formula can be used when the ambient temperature of the PCB is
CC
x I
CC
CONDITIONS
). This formula can be used when the temperature of the exposed
CONDITIONS
A
Continuous Power Dissipation (Note 2)....................................5W
θj
θj
Operating Temperature Range (Note 5) .....T
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
is the ambient temperature of the device and PCB.
A
C
(Notes 3, 4)...............................................................+38°C/W
(Notes 2, 3) ..............................................................+13°C/W
C
= -40°C to +85°C. IF+ and IF- are DC grounded through an
MIN
650
800
650
-3
0
4.75
MIN
2
TYP
TYP
5.00
85
C
= -40°C to +85°C
MAX
1000
1250
MAX
850
250
5.25
100
+3
0.8
UNITS
UNITS
MHz
MHz
MHz
dBm
mA
V
V
V