SI4330-B1-FM Silicon Laboratories Inc, SI4330-B1-FM Datasheet - Page 62

• Manufacturer Part Number: SI4330-B1-FM
• Description: IC RCVR ISM 960MHZ 3.6V 20-QFN
• Manufacturer: Silicon Laboratories Inc
• Type: ISM Receiverr

Specifications of SI4330-B1-FM

• Package / Case: 20-QFN
• Frequency: 960MHz
• Sensitivity: -118dBm
• Data Rate - Maximum: 128kbps
• Modulation Or Protocol: FSK, GFSK, OOK
• Current - Receiving: 18.5mA
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Voltage - Supply: 1.8 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Operating Frequency: 240 MHz to 960 MHz
• Operating Supply Voltage: 3 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Supply Current: 18.5 mA
• Package: 20QFN EP
• Maximum Data Rate: 256 Kbps
• Transmission Media Type: Wireless
• Power Supply Type: Analog
• Typical Operating Supply Voltage: 3 V
• Minimum Operating Supply Voltage: 1.8 V
• Maximum Operating Supply Voltage: 3.6 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Applications: -
• Memory Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1629-5; SI4330-V2-FM

Si4330-B1
62
Notes: General
Note: Solder Mask Design
Notes: Stencil Design
Notes: Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This land pattern design is based on IPC-7351 guidelines.
1. All metal pads are to be non-solder mask defined (NSMD). Clearance
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for the
4. A 2x2 array of 1.10 x 1.10 mm openings on 1.30 mm pitch should be
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020
between the solder mask and the metal pad is to be 60 µm minimum, all
the way around the pad.
walls should be used to assure good solder paste release.
perimeter pads.
used for the center ground pad.
specification for small body components.
Symbol
C1
C2
X1
X2
Y1
Y2
E
Table 19. PCB Land Pattern Dimensions
Rev 1.0
3.90
3.90
0.20
2.65
0.65
2.65
Min
Millimeters
0.50 REF
Max
4.00
4.00
0.30
2.75
0.75
2.75