RGPSM202 Semtech, RGPSM202 Datasheet - Page 6

MODULE SLIM GPS RECEIVER LP

RGPSM202

Manufacturer Part Number
RGPSM202
Description
MODULE SLIM GPS RECEIVER LP
Manufacturer
Semtech
Datasheet

Specifications of RGPSM202

Frequency
1.575GHz
Sensitivity
-143dBm
Modulation Or Protocol
GPS
Applications
Automotive, Laptop, PDA
Current - Receiving
25mA
Data Interface
PCB, Surface Mount
Antenna Connector
PCB, Surface Mount
Voltage - Supply
3 V ~ 3.65 V
Package / Case
Module
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Operating Temperature
-
Memory Size
-
Data Rate - Maximum
-
4.4
The RGPSM202 module PCB is 1mm thick FR4 board. Its pin out uses castellation joints. It contains BGA components,
has a shield around the edge. It is designed for a secondary re-flowed in customers manufacturing process.
4.4.1
The customer solder profile choice is dictated by the solder profile used in the assembly process of the RGPSM202
module. In the Customer Solder Profile, it is recommended to use a solder content of 63% Tin and 37% lead, with a peak
temperature of 200°C, but not exceeding 205°C maximum.
5
5.1
VCC – This is the main power supply
DGND – These are the power and signal ground pins for the digital / MCU section
RFGND – These are the power and signal ground pins for the RF section
VBKP – This is the back-up supply for the on-board hardware Real Time Clock
RXDA – Serial Receive data. This input pin has a pull-up resistor.
TXDA – Serial Transmit data
© Semtech 2005
INTERFACE DEFINITION, PRINCIPLES OF OPERATION
PRODUCTION ISSUES
DATA/RF INTERFACE
Proposed Customer Solder Profile
Figure 2 Pad positions and pad details
6
SlimGPS™ Receiver
RGPSM202
www.semtech.com

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