SI4739-C40-GU Silicon Laboratories Inc, SI4739-C40-GU Datasheet - Page 39
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SI4739-C40-GU
Manufacturer Part Number
SI4739-C40-GU
Description
IC RX FM/WB RAD RDS/RBDS 24SSOP
Manufacturer
Silicon Laboratories Inc
Datasheet
1.SI4737-C-EVB.pdf
(42 pages)
Specifications of SI4739-C40-GU
Frequency
520kHz ~ 1.71MHz, 64MHz ~ 108MHz, 162.4MHz ~ 162.55MHz
Modulation Or Protocol
AM, FM, WB
Applications
General Purpose
Current - Receiving
19.9mA
Data Interface
PCB, Surface Mount
Antenna Connector
PCB, Surface Mount
Features
RSSI Equipped
Voltage - Supply
2V ~ 5.5V
Operating Temperature
-20°C ~ 85°C
Package / Case
24-SSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Sensitivity
-
Memory Size
-
Data Rate - Maximum
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
14. PCB Land Pattern: Si4736/37 SSOP
Figure 17 illustrates the PCB land pattern details for the Si4736/37-C40-GU SSOP. Table 20 lists the values for the
dimensions shown in the illustration.
General:
Solder Mask Design:
Stencil Design:
Card Assembly:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This land pattern design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
7. A No-Clean, Type-3 solder paste is recommended.
8. The recommended card reflow profile is per the JEDEC/IPC J-STD-020
solder mask and the metal pad is to be 60 µm minimum, all the way around the
pad.
should be used to assure good solder paste release.
specification for Small Body Components.
Dimension
X1
Y1
C
E
Table 20. PCB Land Pattern Dimensions
Figure 17. PCB Land Pattern
Rev. 1.0
5.20
0.35
1.55
Min
0.65 BSC
Si4736/37/38/39-C40
Max
5.40
0.45
1.75
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