UPG2160T5K-E2-A CEL, UPG2160T5K-E2-A Datasheet
UPG2160T5K-E2-A
Specifications of UPG2160T5K-E2-A
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UPG2160T5K-E2-A Summary of contents
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... ISL4 = 13 dB TYP 2.5 to 3.0 GHz, V • Handling power : P in (0.1 dB) • High-density surface mounting : 6-pin plastic TSSON package (1.0 × 1.0 × 0.37 mm) APPLICATIONS • L, S-band digital cellular or cordless telephone TM • W-LAN, WLL and Bluetooth etc. ORDERING INFORMATION Part Number Order Number µ ...
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PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) (Top View TRUTH TABLE V INPUT−OUTPUT1 cont High OFF Low ON ABSOLUTE MAXIMUM RATINGS (T Parameter Symbol Supply Voltage V Switch Control Voltage ...
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ELECTRICAL CHARACTERISTICS (T = +25° cont (H) specified) Parameter Symbol Insertion Loss 1 L ins Insertion Loss 2 L ins Insertion Loss 3 L ins Insertion Loss 4 L ...
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EVALUATION CIRCUIT 1 000 pF Remark The application circuits and their parameters are for reference only and are not intended for use in actual design-ins INPUT V DD cont 1 000 pF C ...
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ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD V cont INPUT V DD USING THE NEC EVALUATION BOARD Symbol Values C1 000 pF C1 Data Sheet PG10635EJ01V0DS µ PG2160T5K OUTPUT2 OUTPUT1 5 ...
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TYPICAL CHARACTERISTICS (T capacitors = 56 pF, using test fixture, unless otherwise specified) INPUT-OUTPUT1 INSERTION LOSS vs. FREQUENCY 2.5 2.0 1.5 1.0 0 –0 –1.0 –1.5 –2.0 –2.5 0.1 0.7 1.3 1.9 Frequency f (GHz) INPUT-OUTPUT1 ...
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INPUT-OUTPUT1 OUTPUT RETURN LOSS vs. FREQUENCY –10 1 –20 – –40 –50 0.1 0.7 1.9 1.3 Frequency f (GHz) OUTPUT POWER vs. INPUT POWER + 2.0 GHz +30 +25 +20 ...
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MOUNTING PAD DIMENSIONS 6-PIN PLASTIC TSSON (UNIT: mm) Remark The mounting pad layouts in this document are for reference only. 8 0.31 0.29 0.29 0.31 Data Sheet PG10635EJ01V0DS µ PG2160T5K ...
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PACKAGE DIMENSIONS 6-PIN PLASTIC TSSON (UNIT: mm) 0.13±0.07 (Top View) 1.0±0.1 (Bottom View) 1.0±0.1 +0.07 0.15 –0.05 0.175±0.075 0.23±0.07 Data Sheet PG10635EJ01V0DS µ PG2160T5K +0.03 0.37 –0.05 9 ...
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RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Peak temperature (package surface temperature) Time at peak ...
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Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A. • The information in this document is current as of September, 2006. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC ...
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... Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth. For further information, please contact NEC Compound Semiconductor Devices Hong Kong Limited E-mail: contact@ncsd-hk.necel.com Hong Kong Head Office TEL: +852-3107-7303 Taipei Branch Office ...
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... CAS numbers and other limited information may not be available for release event shall CEL’s liability arising out of such information exceed the total purchase price of the CEL part(s) at issue sold by CEL to customer on an annual basis. ...