ZMXM-401-1C CEL, ZMXM-401-1C Datasheet - Page 10

• Manufacturer Part Number: ZMXM-401-1C
• Description: MODULE MATRIX TXRX W/MMCX CONN
• Manufacturer: CEL
• Series: Matrixr

Specifications of ZMXM-401-1C

• Frequency: 2.4GHz
• Data Rate - Maximum: 250kbps
• Modulation Or Protocol: 802.15.4
• Applications: Mesh, p2p Networks
• Power - Output: 10dBm ~ 20dBm
• Sensitivity: -92dBm
• Voltage - Supply: 2.1 V ~ 3.6 V
• Current - Receiving: 33mA
• Current - Transmitting: 130mA @ 100mW
• Data Interface: PCB, Surface Mount
• Memory Size: 128kB Flash, 8kB RAM
• Antenna Connector: MMCX
• Operating Temperature: -40°C ~ 85°C
• Package / Case: Module
• Wireless Frequency: 2.4 GHz
• Interface Type: UART
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: CC2430

SHIPMENT, HANDLING, AND STORAGE
Shipment
Matrix Modules are delivered in single piece, or 50 piece cartons in individual anti-static bags.
Handling
Matrix Modules are designed and packaged to be processed in an automated assembly line.
!Warning
destroy or damage the module permanently.
!Warning
and precautions are summarized in Section 2.1. Read carefully to prevent permanent damages due to moisture intake.
Moisture Sensitivity Level (MSL)
MSL 3, per J-STD-033
Storage
Storage/Shelf life in sealed bags is 12 months at <40ºC and <90% relative humidity.
PROCESSING
Reflow Soldering
A convection soldering oven is recommended over the infrared radiation type oven. Convection ovens allow more precise
temperature control, and more even heating of parts regardless of material composition, thickness, or color.
Preheat Phase
Initial heating of component leads and solder paste balls, for removal of residual humidity.
Note: The preheat phase is not intended to replace prior baking procedures.
• Temperature rise rate: 0.8-1.7ºC/sec
Note: Excessive slumping can result if the temperature rise is too rapid.
• Time: 60-120 seconds
Note: If the preheat is insufficient, large solder balls tend to be generated. Conversely, if preheat is excessive,
• End Temperature: 150-200ºC
Heating/Relow Phase
The temperature rises above the liquidus temperature of the solder paste selected.
Avoid a sudden rise in temperature as any slump of the solder paste could become worse.
• Limit time above liquidus temperature to 35-90 seconds.
• Peak reflow temperature: 230-250ºC
small and large balls will be generated in clusters.
Matrix Modules contain highly sensitive electronic circuitry. Handling without proper ESD protection may
According to JEDEC ISP, Matrix Modules are moisture sensitive devices. Appropriate handling instructions
ZMXM-400 Series