STEVAL-TDR017V1 STMicroelectronics, STEVAL-TDR017V1 Datasheet - Page 14

• Manufacturer Part Number: STEVAL-TDR017V1
• Description: BOARD DEM UHF RFID READ PD84001
• Manufacturer: STMicroelectronics
• Type: UHF Readerr

Specifications of STEVAL-TDR017V1

• Contents: Board
• Operating Supply Voltage: 7.2 V
• Product: Power Management Development Tools
• For Use With/related Products: PD84001
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-10761

Package mechanical data
6.1
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Thermal pad and via design
Thernal vias are required in the PCB layout to effectively conduct heat away from the
package. The via pattern has been designed to address thermal, power dissipation and
electrical requirements of the device.
The via pattern is based on thru-hole vias with 0.203 mm to 0.330 mm finished hole size on
a 0.5 mm to 1.2 mm grid pattern with 0.025 plating on via walls. If micro vias are used in a
design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar
results.
Figure 19. Pad layout details
SOT-89
PD84001