STEVAL-TDR028V1 STMicroelectronics, STEVAL-TDR028V1 Datasheet - Page 8

• Manufacturer Part Number: STEVAL-TDR028V1
• Description: BOARD DEMO RF PWR AMP STAC2942B
• Manufacturer: STMicroelectronics
• Type: Power Amplifierr

Specifications of STEVAL-TDR028V1

• Contents: Board
• Maximum Operating Temperature: + 70 C
• Operating Supply Voltage: 48 V
• Product: Power Management Development Tools
• For Use With/related Products: STAC2942B
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-10763

STAC2942B mounting recommendations
4.7.2
4.8
8/11
material set featuring low creep and fatigue resistance, the complete system insures that
pressure is maintained uniformly over time.
Procedure
Tighten both fastener systems to each end of the package body to a “finger-tight” condition,
approximately 0.4 in-lb (0.05 N-m, 0.5 kg-cm).
Use a torque driver or equivalent means to tighten both screws to the recommended torque
of 5 in-lbs (0.6 N-m, 5.8 kg-cm).
Depending upon the choice of TIM, the required torque may be adjusted within the following
ranges without mechanical damage to the device:
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Electrical connection
Leads and/or flanges should be attached to the PCB and/or copper heatsinks using typical
Sn63Pb37 or Pb-free solders, in accordance with the supplier's recommendations.
However, the following guidelines with respect to the package should be considered:
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Min.: 3.5 in-lb (0.4 N-m, 4 kg-cm)
Max.: 6.5 in-lb (0.75 N-m, 7.5 kg-cm)
Avoid, as much as possible, the use of flux or flux solutions as it is a potential source of
contamination to the device.
The leads of the transistor may be tinned prior to assembly into the PCB. This practice
is used in situations when it is undesirable to introduce even a small amount of gold into
the solder composition, forestalling the possibility of solder embrittlement issues. The
source of Au stems from the lead and/or backside surfaces, which are plated with 40 to
100 µin (1 to 2.5 µm) of Au.
The amount of solder to be used depends on the type of solder and the amount of
allowable Au in the final solder composition. It is desirable to increase the amount of
solder when Au content is a concern, such as in Pb-free soldering applications.
It is recommended to use either a solder preform or solder paste having a thickness of
0.001 to 0.010 in (0.03 to 0.3 mm), typically 0.006 in (.15 mm).
Adjustment of the solder preform or paste thickness may be used advantageously to
account for thickness variations in the PCB manufacturing process.
In cases where the backside of the flange is soldered to a copper core or heatsink, the
package design and previously discussed mechanical mounting procedure provide
sufficient downward pressure on the solder preform, resulting in a thin, high-quality
bondline after a typical solder reflow procedure. In such cases, solder-wells or a solder-
moat around the perimeter of the flange should be considered, to provide a region for
excess solder to flow.
Doc ID 17469 Rev 1
STEVAL-TDR028V1