MS5541-CM Measurement Specialties Inc., MS5541-CM Datasheet - Page 18

• Manufacturer Part Number: MS5541-CM
• Description: MODULE 14 BAR PRESSURE MINI SNSR
• Manufacturer: Measurement Specialties Inc.

Specifications of MS5541-CM

• Pressure Type: Absolute
• Operating Pressure: 203.05 PSI, 14bar
• Output: Digital
• Voltage - Supply: 2.2 V ~ 3.6 V
• Termination Style: PCB
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 6.2 x 6.4mm Module
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 223-1099-2

ASSEMBLY
MECHANICAL STRESS
It is recommended to avoid mechanical stress on the PCB on which the sensor is mounted. The thickness of the
PCB should be not below 1.6 mm. A thicker PCB is stiffer creating less stress on the soldering contacts. For
applications where mechanical stress cannot be avoided (for example ultrasound welding of the case or thin
PCB’s in watches) please fix the sensor with drops of low stress epoxy (for example Hysol FP-4401).
MOUNTING
The MS5541C can be placed with automatic Pick&Place equipment using vacuum nozzles. It will not be
damaged by the vacuum. Due to the low stress assembly the sensor does not show pressure hysteresis effects.
Special care has to be taken to not touch the protective gel of the sensor during the assembly.
It is important to solder all contact pads. The Pins PEN and PV shall be left open or connected to Vdd. Do not
connect the Pins PEN and PV to GND!
SEALING WITH O-RING
In products like diving computers the electronics must be protected against direct water or humidity. For those
products the MS5541C provides the possibility to seal with an O-ring. The protective cap of the MS5541C is
made of special anticorrosive stainless steel with a polished surface. In addition to this the MS5541C is filled with
silicone gel covering the sensor and the bonding wires. The O-ring (or O-rings) shall be placed at the outer
diameter of the metal cap. This method avoids mechanical stress because the sensor can move in vertical
direction.
CLEANING
The MS5541C has been manufactured under cleanroom conditions. Each device has been inspected for the
homogeneity and the cleanness of the silicone gel. It is therefore recommended to assemble the sensor under
class 10’000 or better conditions. Should this not be possible, it is recommended to protect the sensor opening
during assembly from entering particles and dust. To avoid cleaning of the PCB, solder paste of type “no-clean”
shall be used. Cleaning might damage the sensor!
ESD PRECAUTIONS
The electrical contact pads are protected against ESD according to 4 kV HBM (human body model). It is
therefore essential to ground machines and personal properly during assembly and handling of the device. The
MS5541C is shipped in antistatic transport boxes. Any test adapters or production transport boxes used during
the assembly of the sensor shall be of an equivalent antistatic material.
DA5541C_001.doc
February 19th, 2008
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