MPXV5050VC6T1 Freescale Semiconductor, MPXV5050VC6T1 Datasheet
MPXV5050VC6T1
Specifications of MPXV5050VC6T1
Related parts for MPXV5050VC6T1
MPXV5050VC6T1 Summary of contents
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... Freescale Semiconductor, Inc., 2005, 2009. All rights reserved. ORDERING INFORMATION # of Ports Pressure Type Single Dual Gauge • • Vacuum/Gauge SMALL OUTLINE PACKAGE MPXV5050VC6T1 CASE 482A-01 Pressure MPXV5050VC6T1 Rev 2, 11/2009 MPXV5050V Series - kPa (-7. psi) 0.1 to 4.6 V Output Application Examples • Vacuum Pump Monitoring Device Marking Differential Absolute MPXV5050V ...
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... Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 7. Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test. 8. Offset ( defined as the output voltage at the minimum rated pressure. off MPXV5050VC6T1 2 = 5.0 Vdc 25°C unless otherwise noted, P1 > P2) S ...
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... Figure 1. Fully Integrated Pressure Sensor Schematic Sensors Freescale Semiconductor Symbol P max T stg Gain Stage #2 Thin Film And Temperature Compensation Ground And Reference Gain Stage #1 Shift Circuitry Pins and 8 are no connects 3 GND Pressure Value Units 200 kPa °C -40 to +125 °C -40 to +125 4 V out MPXV5050VC6T1 3 ...
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... MAX –50 –40 MPXV5050VC6T1 4 A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXV5050 series pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media ...
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... Sensors Freescale Semiconductor x (0.018 0.92 MPXV5050V Break Points Temp Multiplier – +125 3 –40 – Temperature in °C MPXV5050V MPXV5050V Error Limits for Pressure –50 –40 –30 –20 –10 Pressure 80 100 120 140 Pressure (in kPa) 0 Pressure Error (Max) – kPa ±1.25 kPa MPXV5050VC6T1 5 ...
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... With the correct pad geometry, the packages will self-align when subjected to a 0.060 TYP 8X 1.52 MPXV5050VC6T1 6 SURFACE MOUNTING INFORMATION solder reflow process always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts ...
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... G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0˚ 7˚ 0˚ 7˚ N 0.444 0.448 11.28 11.38 S 0.709 0.725 18.01 18.41 V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17 -T- SEATING PLANE MPXV5050VC6T1 7 ...
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... For Literature Requests Only: Freescale Semiconductor Literature Distribution Center 1-800-441-2447 or +1-303-675-2140 Fax: +1-303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com MPXV5050VC6T1 Rev. 2 11/2009 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document ...