MPXV5004DP Freescale Semiconductor, MPXV5004DP Datasheet - Page 6

• Manufacturer Part Number: MPXV5004DP
• Description: SENSOR PRESSURE SMD 8-SOP
• Manufacturer: Freescale Semiconductor
• Series: MPXV5004r

Specifications of MPXV5004DP

• Pressure Type: Differential
• Operating Pressure: 0.57 PSI, 3.92 kPa
• Port Size: Male, 0.13" (3.302mm) Tube, Dual
• Output: 0 ~ 4.9V
• Voltage - Supply: 4.75 V ~ 5.25 V
• Termination Style: PCB
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 8-SOP Dual Port
• Accuracy: 1.5 %
• Mounting Style: SMD/SMT
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: 0 C
• Operating Supply Voltage: 5 V
• Supply Voltage (min): 4.75 V
• Supply Voltage (max): 5.25 V
• Supply Current: 10 mA
• Output Voltage: 4.9 V
• Shutdown: No
• Operating Pressure Range: 0 To 3.92kPa
• Connection Size: 3.302mm
• Sensitivity, V/p: 1V/kPa
• Sensor Case Style: SOP
• No. Of Pins: 8
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

MPXV5004G
6
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE
MOUNTED APPLICATIONS
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
Surface mount board layout is a critical portion of the total
Pressure
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)
0.060 TYP 8X
1.52
Figure 6. SOP Footprint (Case 482)
0.100 TYP 8X
2.54
0.660
16.76
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
inch
mm
SCALE 2:1
0.100 TYP 8X
2.54
0.300
7.62
Freescale Semiconductor
Sensors