MPX5010GP Freescale Semiconductor, MPX5010GP Datasheet - Page 7

• Manufacturer Part Number: MPX5010GP
• Description: SENSOR GAUGE PRESS 1.45 PSI MAX
• Manufacturer: Freescale Semiconductor
• Series: MPX5010r

Specifications of MPX5010GP

• Pressure Type: Gauge
• Operating Pressure: 1.45 PSI
• Port Size: Male, 0.194" (4.9276mm) Tube
• Output: 0 ~ 4.7V
• Voltage - Supply: 4.75 V ~ 5.25 V
• Termination Style: PCB
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 6-SIP
• Accuracy: 5 %
• Mounting Style: Through Hole
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 5 V
• Supply Voltage (min): 4.75 V
• Supply Voltage (max): 5.25 V
• Supply Current: 5 mA
• Output Voltage: 4.7 V
• Shutdown: No
• Brand/series: MPX5010
• Current, Rating: 5 mAdc
• Function: Pressure
• Mounting Type: PCB
• Pressure, Operating: 0 to 1.45 PSI
• Primary Type: Pressure
• Range, Measurement: 1.45 PSI
• Response Time: 1 ms
• Sensing Mode: Strain Gauge
• Sensitivity: 450 mV⁄kPa
• Technology: Piezoresistive
• Temperature, Operating, Maximum: 125 °C
• Temperature, Operating, Minimum: -40 °C
• Termination: Solder
• Vg, Rating: 5 VDC
• Voltage, Offset: 0.2 VDC
• Voltage, Supply: 5 VDC
• Operating Pressure Range: 0 To 10kPa
• Connection Size: 4.928mm
• Sensitivity, V/p: 450mV/kPa
• Sensor Case Style: SIP
• No. Of Pins: 6
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Sensors
Freescale Semiconductor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluorosilicone gel
which protects the die from harsh media. The MPX pressure
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
MPX5010DP
MPX5010GP
MPX5010GS
MPX5010GSX
MPXV5010G6U
MPXV5010GC6U/6T1
MPXV5010GC7U
MPXV5010GP
MPXV5010DP
MPVZ5010G6U/6T1
MPVZ5010G7U
MPVZ5010GW6U
MPVZ5010GW7U
Freescale designates the two sides of the pressure sensor
Surface mount board layout is a critical portion of the total
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Part Number
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
0.060 TYP 8X
1.52
Figure 5. SOP Footprint (Case 482)
0.100 TYP 8X
2.54
Case Type
0.660
16.76
867C
867B
867E
867F
482A
482C
1369
1351
482B
482
1735
1560
482
sensor is designed to operate with positive differential
pressure applied, P1 > P2.
table below:
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
The Pressure (P1) side may be identified by using the
inch
mm
Side with Port Attached
Side with Port Attached
Side with Port Attached
Stainless Steel Cap
Side with Port Attached
Side with Port Attached
Side with Port Attached
Side with Part Marking
Side with Part Marking
Stainless Steel Cap
Stainless Steel Cap
Vertical Port Attached
Vertical Port Attached
SCALE 2:1
0.100 TYP 8X
2.54
0.300
7.62
Side Identifier
Pressure (P1)
Pressure
MPX5010
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