MPX5100AP Freescale Semiconductor, MPX5100AP Datasheet - Page 8

• Manufacturer Part Number: MPX5100AP
• Description: SENSOR ABS PRESS 16.68 PSI MAX
• Manufacturer: Freescale Semiconductor
• Series: MPX5100r

Specifications of MPX5100AP

• Pressure Type: Absolute
• Operating Pressure: 2.2 ~ 16.7 PSI
• Port Size: Male, 0.194" (4.9276mm) Tube
• Output: 0.2 ~ 4.7V
• Accuracy: ±2.5%
• Voltage - Supply: 4.75 V ~ 5.25 V
• Termination Style: PCB
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 6-SIP
• Mounting Style: Through Hole
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 5 V
• Supply Voltage (min): 4.75 V
• Supply Voltage (max): 5.25 V
• Supply Current: 7 mA
• Output Voltage: 4.7 V
• Shutdown: No
• Brand/series: MPX5100
• Current, Rating: 7 mAdc
• Function: Pressure
• Linearity: ± 2.5%
• Mounting Type: PCB
• Pressure, Operating: 2.17 to 16.68 PSI
• Primary Type: Pressure
• Range, Measurement: 14.5 PSI
• Response Time: 1 ms
• Sensing Mode: Strain Gauge
• Sensitivity: 4.5 mV⁄kPa
• Technology: Piezoresistive
• Temperature, Operating, Maximum: 125 °C
• Temperature, Operating, Minimum: -40 °C
• Termination: Solder
• Vg, Rating: 5 VDC
• Voltage, Offset: 0.2 VDC
• Voltage, Supply: 5 VDC
• Operating Pressure Range: 0 To 100kPa
• Connection Size: 4.928mm
• Sensitivity, V/p: 45mV/kPa
• Sensor Case Style: SIP
• No. Of Pins: 6
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Contains lead / RoHS Compliant

MPX5100
8
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluoro silicone gel
which protects the die from harsh media. The MPX pressure
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
MPX5100A, MPX5100D
MPX5100DP
MPX5100AP, MPX5100GP
MPXV5100GC6U
MPXV5100GC7U
MPXV5100DP
MPXV5100GP
Freescale designates the two sides of the pressure sensor
Surface mount board layout is a critical portion of the total
Pressure
Part Number
Minimum Recommended Footprint for Surface Mounted Applications
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
SURFACE MOUNTING INFORMATION
Figure 6. Small Outline Package Footprint
sensor is designed to operate with positive differential
pressure applied, P1 > P2.
table below.
Case Type
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder
867C
867B
482A
482C
The Pressure (P1) side may be identified by using the
1351
1369
867
Stainless Steel Cap
Side with Part Marking
Side with Port Attached
Side with Port Attached
Side with Port Attached
Side with Part Marking
Side with Port Attached
Pressure (P1) Side Identifier
Freescale Semiconductor
Sensors