MPXH6300AC6T1 Freescale Semiconductor, MPXH6300AC6T1 Datasheet - Page 6
![SENSOR PRESSURE 20-304KPA 1317A](/photos/37/63/376383/482a-01_sml.jpg)
MPXH6300AC6T1
Manufacturer Part Number
MPXH6300AC6T1
Description
SENSOR PRESSURE 20-304KPA 1317A
Manufacturer
Freescale Semiconductor
Series
MPXH6300r
Datasheet
1.MPXH6300A6U.pdf
(11 pages)
Specifications of MPXH6300AC6T1
Pressure Type
Absolute
Operating Pressure
3 ~ 42 PSI
Output
0 ~ 4.9V
Voltage - Supply
4.85 V ~ 5.35 V
Termination Style
PCB
Operating Temperature
-40°C ~ 125°C
Package / Case
8-SSOP with Port
Mounting Style
SMD/SMT
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Operating Supply Voltage
5.1 V
Output Voltage
4.847 V to 4.977 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
Q1710062
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPXH6300AC6T1
Manufacturer:
FREESCALE
Quantity:
5 000
MPXH6300A
6
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
Surface mount board layout is a critical portion of the total
Pressure
MINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL PACKAGES
Figure 5. SSOP Footprint (Case 1317 and 1317A)
0.150
3.81
0.050
1.27
TYP
0.053 TYP 8X
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
1.35
0.027 TYP 8X
0.69
0.387
9.83
inch
mm
Freescale Semiconductor
Sensors