MP3V7007GP Freescale Semiconductor, MP3V7007GP Datasheet
MP3V7007GP
Specifications of MP3V7007GP
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MP3V7007GP Summary of contents
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... MP3V7007 Rev 0, 11/2008 MP3V7007 Series - kPa (- psi) 0.2 to 2.8 V Output Application Examples • Hospital Beds • HVAC • Respiratory Systems • Process Control Pressure Type Device Marking Gauge Differential Absolute MP3V7007G • MP3V7007G • MP3V7007GP • MP3V7007DP • MP3V7007DP CASE 1351-01 ...
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... FSS ±5.0 — — — — 171 — t — 1.0 — R — 0.1 — O+ — — 20 — ±0.5 — — — 25°C. FSS Freescale Semiconductor Unit kPa Vdc mAdc Vdc Vdc Vdc %V FSS mV/kPa ms mAdc ms %V FSS Sensors ...
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... Storage Temperature Operating Temperature 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. Sensing Element Figure 1. Integrated Pressure Sensor Schematic Sensors Freescale Semiconductor Symbol P max T stg ...
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... Element Figure 2. Cross-Sectional Diagram SOP (not to scale out V s IPS 1.0 μF GND 0.01 μF shows the recommended decoupling circuit for shows the sensor output signal relative to Figure Stainless Steel Cap Thermoplastic Case Die Bond OUTPUT 470 pF Freescale Semiconductor 3. The Sensors ...
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... Temperature Error Band 4.0 3.0 Temperature 2.0 Error Factor 1.0 0.0 NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C. Sensors Freescale Semiconductor Transfer Function *(0.057*P+0.5) ± ERROR out 3.0 Vdc S TEMP = 0 to 85°C ...
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... Pressure (P1) side is the side containing fluoro silicone gel which protects the die from harsh media. The pressure Part Number MP3V7007GC6U/C6T1 MP3V7007GP MP3V7007DP MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package ...
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... N - Sensors Freescale Semiconductor PACKAGE DIMENSIONS 0.25 (0.010 PIN 1 IDENTIFIER M CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE Pressure NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. ...
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... BSC 2.54 BSC F 0.240 0.260 6.10 6.60 K 0.115 0.135 2.92 3.43 L 0.040 0.060 1.02 1.52 M 0.270 0.290 6.86 7.37 N 0.160 0.180 4.06 4.57 P 0.009 0.011 0.23 0.28 T 0.110 0.130 2.79 3.30 θ 0˚ 7˚ 0˚ 7˚ Freescale Semiconductor Sensors ...
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... PLACES 4 TIPS 0.008 (0.20 0.004 (0. ∅ 0.004 (0. DETAIL G C Sensors Freescale Semiconductor PACKAGE DIMENSIONS GAGE e PLANE e/2 .014 (0.35 SEATING PLANE CASE 1369-01 ISSUE O SMALL OUTLINE PACKAGE Pressure θ DETAIL G NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. ...
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... Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer ...