MPX5100DP Freescale Semiconductor, MPX5100DP Datasheet - Page 4

IC SENSOR PRESS 14.5 PSI MAX

MPX5100DP

Manufacturer Part Number
MPX5100DP
Description
IC SENSOR PRESS 14.5 PSI MAX
Manufacturer
Freescale Semiconductor
Series
MPX5100r
Datasheets

Specifications of MPX5100DP

Pressure Type
Differential
Operating Pressure
0 ~ 14.5 PSI
Port Size
Male, 0.194" (4.9276mm) Tube, Dual
Output
0.2 ~ 4.7V
Accuracy
±2.5%
Voltage - Supply
4.75 V ~ 5.25 V
Termination Style
PCB
Operating Temperature
-40°C ~ 125°C
Package / Case
6-SIP
Mounting Style
Through Hole
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Operating Supply Voltage
5 V
Supply Voltage (min)
4.75 V
Supply Voltage (max)
5.25 V
Supply Current
7 mA
Output Voltage
4.7 V
Shutdown
No
Brand/series
MPX5100
Current, Rating
7 mAdc
Function
Pressure
Linearity
± 2.5%
Mounting Type
PCB
Pressure, Operating
0 to 14.5 PSI
Primary Type
Pressure
Range, Measurement
14.5 PSI
Response Time
1 ms
Sensing Mode
Strain Gauge
Sensitivity
4.5 mV⁄kPa
Technology
Piezoresistive
Temperature, Operating, Maximum
125 °C
Temperature, Operating, Minimum
-40 °C
Termination
Solder
Vg, Rating
5 VDC
Voltage, Offset
0.2 VDC
Voltage, Supply
5 VDC
Operating Pressure Range
0 To 100kPa
Connection Size
4.928mm
Sensitivity, V/p
45mV/kPa
Sensor Case Style
SIP
No. Of Pins
6
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPX5100DP
Manufacturer:
NXP
Quantity:
5 000
Part Number:
MPX5100DP
0
Maximum Ratings
Table 2. Maximum Ratings
1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MPX5100
4
Maximum Pressure (P1 > P2)
Storage Temperature
Operating Temperature
Figure 1
Figure 2
Pressure
shows a block diagram of the internal circuitry integrated on a pressure sensor chip in a Unibody Package.
shows a block diagram of the internal circuitry integrated on a pressure sensor chip in a Small Outline Package.
Figure 2. Fully Integrated Pressure Sensor Schematic for Small Outline Package Devices
Figure 1. Fully Integrated Pressure Sensor Schematic for Unibody Package Devices
(1)
Rating
Sensing
Element
Sensing
Element
GND
GND
2
3
Compensation
Gain Stage #1
Compensation
Gain Stage #1
Temperature
Temperature
Thin Film
Thin Film
Pins 4, 5, and 6 are NO CONNECTS.
Pins 1 and 5-8 are NO CONNECTS.
and
and
V
V
S
S
3
2
Gain Stage #2
Gain Stage #2
Shift Circuitry
Shift Circuitry
Reference
Reference
Symbol
Ground
Ground
P
T
and
and
T
max
stg
A
V
V
1
4
out
out
-40° to +125°
-40° to +125°
Value
400
Freescale Semiconductor
Unit
kPa
°C
°C
Sensors

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