60-BGA-5 ITW Chemtronics, 60-BGA-5 Datasheet

SOLDER-WICK BGA NO-CLEAN 5'

60-BGA-5

Manufacturer Part Number
60-BGA-5
Description
SOLDER-WICK BGA NO-CLEAN 5'
Manufacturer
ITW Chemtronics
Series
Soder-Wick® SW 60r
Type
No Cleanr
Datasheets

Specifications of 60-BGA-5

Length
5' (1.52m)
Color
Purple
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
CHEMTRONICS
Technical Data Sheet
PRODUCT DESCRIPTION
Soder-Wick
provide fast and safe desoldering without
leaving behind harmful flux residues. Soder-
Wick
copper braid and a patented flux technology
to
desoldering braid. Soder-Wick
SD is available on ESD safe bobbins for
protection against damage due to static
electricity.
TYPICAL APPLICATIONS
Soder-Wick
solder from:
Requires little or no post solder cleaning
No corrosive residues
Halide free
ESD Safe bobbins meet specs:
Minimal risk of heat and static
component damage
MIL-STD-1686C
MIL-HDBK-263B
Static decay provision of
MIL-B-81705C
make
®
Lugs and Posts
Micro Circuits
Surface Mount Device Pads
Ball Grid Array Pads
No Clean uses pure, oxygen free
®
®
an
No Clean safely removes
No Clean is designed to
efficient
®
Soder-Wick
and
®
Desoldering Braid
No Clean
effective
®
TYPICAL PRODUCT DATA AND
PHYSICAL PROPERTIES
RoHS/WEEE
Status
SODER-WICK
EXCEEDS:
MIL-F-14256F, Type R
DOD-STD-883E, Method 2022
Bellcore TR-NWT-000078
ANSI/IPC J SF-818
Bellcore TR-NWT-000078
ANSI/IPC J SF-818
Electromigration
At 10x magnification no evidence of
electromigration or heavy corrosion.
Silver Chromate Test Paper
Copper Mirror Test
Shelflife
No Clean
Group A
4.8 x 10
Group E
Group F
2.3 x 10
After 96 Hours (megohms) 2 x 10
After 168 Hours (ohms) 1.8 x 10
Average Insulation Resistance
(megohms)-One Decade Limit
1-2
Surface Insulation Resistance
10
6
2.6 x 10
TDS # SWNoClean
®
2-3
NO CLEAN MEETS OR
3.87 x 10
3.93 x 10
Group B
3.8 x 10
Initial
10
2.8 x 10
6
3
3
3-4
2 years
10
PASS
PASS
8
4
Limit
2.84 x 10
1.24 x 10
4.1 x 10
Group C
Limit
Final
: PASS
: PASS
: PASS
2.8 x 10
4-5
6
4
4
10

60-BGA-5 Summary of contents

Page 1

CHEMTRONICS Technical Data Sheet PRODUCT DESCRIPTION ® Soder-Wick No Clean is designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder- ® Wick No Clean uses pure, oxygen free copper braid and a patented flux technology ...

Page 2

... Choose a solder iron tip equal to or slightly larger than the pad or connection. 3) Set temperature of iron between 600-750°F. 4) Place wick on solder joint and place tip of hot iron on top of wick solder becomes molten, the color of the wick will change from copper to silver ...