832B-375ML MG Chemicals, 832B-375ML Datasheet - Page 36
![POTTING COMPOUND BLK 2PART 375ML](/photos/15/53/155363/832b-375ml_sml.jpg)
832B-375ML
Manufacturer Part Number
832B-375ML
Description
POTTING COMPOUND BLK 2PART 375ML
Manufacturer
MG Chemicals
Series
832r
Type
Potting Compound, 2 Partr
Specifications of 832B-375ML
Product
Epoxy Compounds
Size
12 oz
Chemical Component
Alkyl Glycidyl Ether/Epichlorohydrin and Bisphenol A
Density, Vapor
Air
Flash Point
190
Odor
Odorless
Physical State
Liquid
Primary Type
Adhesive
Special Features
Kit
Specific Gravity
1.13
Standards
RoHS Compliant
Weight
12 Oz.
For Use With/related Products
Sealing Electronic Components
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
473-1082
34
MG Chemicals Product Catalog
Why do you need a Heat
Transfer Compound?
Improves thermal connections between
heat sinks and components.
Use Heat Transfer Compound on all electric and
electronic devices where efficient heat transfer
cooling through thermal coupling is required:
4Semiconductor mounting devices
4Thermal joints
4Ballast heat transfer mediums
4Power resistor mountings
4Thermocouple wells
4Transistor diodes
4Silicone rectifier base and mounting studs
This Non Silicone Heat Transfer Compound is designed
to eliminate the potential problems of silicone-based
compounds caused by migration and component con-
tamination. Designed for use in transferring heat away
from electrical and electronic devices such as transistors,
power diodes, semi-conductors, ballasts and thermo-
couple wells.
4High thermal conductivity
4High dielectric constant
4High dissipation factor
4Use with heat sinks or metal chassis
4Will not dry or harden
4Meets MIL-DTL-47113D
Available Sizes
Thermal Management
Non-Silicone
Heat Transfer Compound
8610
860
Catalog No.
860-4G
860-60G
860-150G
860-1P
860-1GAL
8610-60G
8610-1P
4g x 100 (0.14 oz x 100)
473 ml (1 pint)
473 ml (1 pint)
1 gal (20 lbs.)
150g (5.2 oz)
60g (2 oz)
60g (2oz)
Size
8610
Format
Singles
Tube
Pail
Tub
Tub
Tub
Tub
Specifications
Physical Properties
Appearance
Consistency
Specific Gravity@ 25°C (77°F)
Bleed % 24 hrs @200°C
Evaporation %24hrs @200°C
Dropping Point
Max. Operating Temp.
Electrical Properties
Thermal conductivity
Dielectric Strength (0.05 GAP)
Dielectric Constant (@ 1000 Hz) ASTM D-150
Dissipation Factor (@ 1000Hz)
Resistivity (Room Temp.)
Designed for use in transferring heat away from electrical
and electronic devices such as transistors, power diodes,
semi-conductors, ballasts and thermocouple wells.
Silicone
Heat Transfer Compound
How does a Heat Sink
Compound work?
Test Method
Visual
ASTM D-217
-
FTM-321
FTM-321
ASTM D-566
-
Hot Wire Method
Heat Flow #36°C
ASTM D-149
ASTM D-150
ASTM D-150
Contact Tech Support 1.800.201.8822
Non Silicone
Off White/Smooth Paste
300-320
2.0% max
> 500°F (260°C)
200°C (392°F)
18.48 x 10
(K Factor, Cal/Sec.cm°K)
350 V/mil
6.38 x 10
2.5 min.
1.0% max
4.4
0.0021
13
-4
ohm
•
cm
300°C (intermittent)
1.5 x 10
200°C (consistent)
860
0.657 W/m °K
White Paste
15
2.0% max
2.0% max
ohm
400 V/mil
300-320
Silicone
2.3 min
0.0032
•
3.81
cm