039-0242-000 ITT Cannon, 039-0242-000 Datasheet - Page 65
039-0242-000
Manufacturer Part Number
039-0242-000
Description
DL1-156P COVER
Manufacturer
ITT Cannon
Datasheet
1.039-0242-000.pdf
(76 pages)
Specifications of 039-0242-000
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
I039-0242-000
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64
ZIF Connectors
PCB Pad Layout
For the PC/RC Versions; The contact tail design
has been modified from a 0,64 (.025) square pin to
a 0,05 (.020) diameter round pin. The change
enables a decrease in the diameter of the through-
holes as well as the solder mounds on PCB’s (d1,
PCB Pad Layout
The soldering of contacts into through (THRU)
holes on a PC Board has become standard for
medical equipment and test equipment for semi-
conductors. As a result of the narrow spacing
between the solder pad and circuit pattern,
crosstalk between signals increases. A solution to
this problem is to make the diameter of the
contacts and solder lands smaller to provide more
space between the lands and the patterns.
and d2 can be wider than D1 and D2). This can
reduce the crosstalk in RF circuits and enhance the
dielectric withstanding voltage in high voltage
circuits.
However, a smaller diameter contact results in
higher impedance.
Cannon designed a solution with a smaller
diameter contact tail. This design application
allows the use of a smaller through-hole diameter.
THRU HOLE
CONTACT
SOLDER
D1
D2
d1
d2
DL/DLM/DLD
Dimensions are shown in mm (inch)
Dimensions subject to change
PC TAIL
Dimensions
1,14 (.045)
0,47 (.018)
1,44 (.057)
0,62 (.024)
CONNECTOR
INSULATOR
PCB
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