MCF51JE256VML Freescale Semiconductor, MCF51JE256VML Datasheet - Page 17
![IC MCU 256K COLDF 104-PBGA](/photos/39/69/396994/bga-104_sml.jpg)
MCF51JE256VML
Manufacturer Part Number
MCF51JE256VML
Description
IC MCU 256K COLDF 104-PBGA
Manufacturer
Freescale Semiconductor
Series
MCF51JEr
Datasheet
1.TWR-MCF51JE.pdf
(50 pages)
Specifications of MCF51JE256VML
Core Processor
Coldfire V1
Core Size
32-Bit
Speed
50MHz
Connectivity
CAN, EBI/EMI, I²C, SCI, SPI, USB OTG
Peripherals
LVD, PWM, WDT
Number Of I /o
69
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 12x12b, D/A 1x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 105°C
Package / Case
104-LFBGA
Core
ColdFire V1
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
SPI, SCI, I2C
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
69
Number Of Timers
2
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCF51JE256VML
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
3.3
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and it is user-determined rather than being controlled by the MCU design. In order to take
P
V
loads), the difference between pin voltage and V
The average chip-junction temperature (T
where:
For most applications, P
(if P
Freescale Semiconductor
I/O
DD
I/O
into account in power calculations, determine the difference between actual pin voltage and V
and multiply by the pin current for each I/O pin. Except in cases of unusually high pin current (heavy
1
2
3
4
T
θ
P
P
P
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
Junction to Ambient Natural Convection
1s — Single layer board, one signal layer
2s2p — Four layer board, 2 signal and 2 power layers
is neglected) is:
JA
A
D
int
I/O
Thermal Characteristics
#
1
2
3
4
= Ambient temperature, °C
= P
= Package thermal resistance, junction-to-ambient, °C/W
= I
= Power dissipation on input and output pins — user determined
int
DD
+ P
× V
I/O
Symbol
DD
T
JMAX
θ
θ
T
, Watts — chip internal power
JA
JA
A
I/O
<< P
Operating temperature range (packaged):
Maximum junction temperature
Thermal resistance
Thermal resistance
int
and can be neglected. An approximate relationship between P
Table 6. Thermal Characteristics
Preliminary — Subject to Change
T
J
J
) in °C can be obtained from:
= T
A
1,2,3,4
1, 2, 3, 4
+ (P
SS
Rating
MCF51JE256
MCF51JE128
104-pin MBGA
100-pin LQFP
81-pin MBGA
80-pin LQFP
104-pin MBGA
100-pin LQFP
81-pin MBGA
80-pin LQFP
or V
D
Single-layer board — 1s
Four-layer board — 2s2p
× θ
DD
JA
)
will be very small.
Preliminary Electrical Characteristics
–40 to 105
–40 to 105
Value
135
67
53
67
53
39
41
39
39
°C/W
°C/W
Unit
°C
°C
D
and T
SS
Eqn. 1
or
1-1
J