73M2901CE-IGVR/F Maxim Integrated Products, 73M2901CE-IGVR/F Datasheet - Page 27

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73M2901CE-IGVR/F

Manufacturer Part Number
73M2901CE-IGVR/F
Description
IC MODEM 3.3V V.22BIS 32-TQFP
Manufacturer
Maxim Integrated Products
Datasheet

Specifications of 73M2901CE-IGVR/F

Data Format
V.21, V.22, V.23, Bell 103, Bell 212A
Baud Rates
300 ~ 9.6k
Interface
Serial
Voltage - Supply
2.7 V ~ 3.6 V
Mounting Type
Surface Mount
Package / Case
32-TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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DS_2901CE_031
Revision History
Teridian Semiconductor Corporation is a registered trademark of Teridian Semiconductor Corporation.
Simplifying System Integration is a trademark of Teridian Semiconductor Corporation.
All other trademarks are the property of their respective owners.
Teridian Semiconductor Corporation makes no warranty for the use of its products, other than expressly
contained in the Company’s warranty detailed in the Teridian Semiconductor Corporation standard Terms
and Conditions. The company assumes no responsibility for any errors which may appear in this
document, reserves the right to change devices or specifications detailed herein at any time without
notice and does not make any commitment to update the information contained herein. Accordingly, the
reader is cautioned to verify that this document is current by comparing it to the latest version on
http://www.teridian.com or by checking with your sales representative.
Rev. 3.4
Revision
2.2.1
3.1
3.2
3.3
3.4
Date
4/20/2004
12/14/2007
1/21/2008
4/3/2009
1/15/2010
Teridian Semiconductor Corp., 6440 Oak Canyon, Suite 100, Irvine, CA 92618
TEL (714) 508-8800, FAX (714) 508-8877, http://www.teridian.com
Description
First publication.
Replaced 32QFN punched with SAWN package, removed leaded package
option, updated schematic and minor clean up.
Changed dimension of bottom exposed pad on 32QFN mechanical package
figure.
Formatted to new Teridian style.
Assigned new document number.
Made minor corrections to Section 5.3 and Section 6.3.
In Section 6.1, duplicated the hardware design considerations from the
73M2901CE Demo Board User Manual.
Moved the 73M2901CE/CL differences from the 73M2901CE Demo Board
User Manual to Section 6.4.
Replaced the schematics in Figure 3 and Figure 4 with new schematics.
Improved the charts in Figure 5 and Figure 6.
Miscellaneous editorial changes.
73M2901CE Data Sheet
27

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