AT3535SY9ZS-RV Kingbright Corp, AT3535SY9ZS-RV Datasheet - Page 7
![LED High Power (> 0.5 Watts) Yellow 0.98W 591nm 13 lm](/photos/15/79/157971/at3535_sml.jpg)
AT3535SY9ZS-RV
Manufacturer Part Number
AT3535SY9ZS-RV
Description
LED High Power (> 0.5 Watts) Yellow 0.98W 591nm 13 lm
Manufacturer
Kingbright Corp
Type
SMD LED Lampr
Datasheet
1.AT3535SY9ZS-RV.pdf
(10 pages)
Specifications of AT3535SY9ZS-RV
Illumination Color
Super Bright Yellow
Wavelength/color Temperature
591 nm
Luminous Flux
17 lm
Viewing Angle
120 deg
Power Rating
1.25 W
Operating Voltage
2.3 V
Operating Current
350 mA
Minimum Operating Temperature
- 40 C
Maximum Operating Temperature
+ 100 C
Led Material
AlGaInP
Led Size
3.5 mm x 3.5 mm
Lens Shape
Flat Round
Number Of Leds
1
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
SPEC NO: DSAI6849
APPROVED: WYNEC
JEDEC Moisture Sensitivity:
Notes:
1. CAUTION - The ‘‘accelerated equivalent’’ soak requirements shall not be used until correlation of damage response, including electrical, after
2. The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag and
3. Supplier may extend the soak times at their own risk.
ESD Protection During Production
1.Minimize friction between the product and surroundings to avoid static buildup.
2.All production machinery and test instruments must be electrically grounded.
3.Operators must wear anti-static bracelets.
4.Wear anti-static suit when entering work areas with conductive machinery.
5.Set up ESD protection areas using grounded metal plating for component handling.
6.All workstations that handle IC and ESD-sensitive components must maintain an electrostatic potential of 150V or less.
7.Maintain a humidity level of 50% or higher in production areas.
8.Use anti-static packaging for transport and storage.
9.All anti-static equipment and procedures should be periodically inspected and evaluated for proper functionality.
Heat Generation:
1.Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making
2.Please determine the operating current with consideration of the ambient temperature local to the LED and refer to the plot
3.The equation ① indicates correlation between T
Level
soak and reflow is established with the ‘‘standard’’ soak requirements or if the known activation energy for diffusion is 0.4 - 0.48 eV. Accelerated
soak times may vary due to material properties, e.g., mold compound, encapsulant, etc. JEDEC document JESD22-A120 provides a method for
determining the diffusion coefficient.
includes the maximum time allowed out of the bag at the distributor’s facility.
If the actual MET is less than 24 hours the soak time may be reduced. For soak conditions of 30 °C/60% RH the soak time is reduced by one hour
For each hour the MET is less than 24 hours. For soak conditions of 60 °C/60% RH, the soak time is reduced by one hour for each five hours the
MET is less than 24 hours.
If the actual MET is greater than 24 hours the soak time must be increased. If soak conditions are 30 °C/60% RH, the soak time is increased one
Hour for each hour that the actual MET exceeds 24 hours. If soak conditions are 60 °C/60% RH, the soak time is increased one hour for each five
Hours that the actual MET exceeds 24 hours.
Electric static discharge can result when static-sensitive products come in contact with the operator or other conductors.
The following procedures may decrease the possibility of ESD damage:
the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the
circuit board and density of LED placement on the board ,as well as other components. It is necessary to avoid intense heat
generation and operate within the maximum ratings given in this specification.
of Permissible Forward current vs. Ambient temperature on CHARACTERISTICS in this specification. Please also take meas
ures to remove heat from the area near the LED to improve the operational characteristics on the LED.
T
Tj = T
Tj = dice junction temperature: °C
T
T
R
R
W = inputting power (IFx VF) : W
2a
j
a
s
thj-a
thj-s
= T
= solder point temperature:°C
= ambient temperature:°C
s
a
= heat resistance from dice junction temperature to ambient temperature : °C/ W
= heat resistance from dice junction temperature to Ts measuring point : °C/ W
+ R
+ R
thj-s
thj-a
4 weeks
*W ………
*W ………
Time
Floor Life
REV NO: V.4
CHECKED: Allen Liu
≤ 30 °C / 60% RH
②
①
Conditions
j
and T
Time (hours)
a
+ 5 / - 0
,and the equation ② indicates correlation between T
696
DATE: APR/20/2009
DRAWN: D.M.Su
2
3.5X3.5mm SMD LED WITH CERAMIC SUBSTRATE
Standard
30 °C / 60% RH
Conditions
Soak Requirements
Time (hours)
+ 1 / - 0
120
Accelerated Equivalent
PAGE: 7 OF 10
ERP: 1212000013
60 °C / 60% RH
Conditions
j
and T
s