SFH 2400-Z OSRAM Opto Semiconductors Inc, SFH 2400-Z Datasheet - Page 7

Photodiodes PHOTODIODE

SFH 2400-Z

Manufacturer Part Number
SFH 2400-Z
Description
Photodiodes PHOTODIODE
Manufacturer
OSRAM Opto Semiconductors Inc
Type
Chipr
Datasheet

Specifications of SFH 2400-Z

Photodiode Material
Silicon
Peak Wavelength
850 nm
Half Intensity Angle Degrees
60 deg
Maximum Reverse Voltage
50 V
Maximum Power Dissipation
120 mW
Maximum Light Current
10 uA
Maximum Dark Current
1 nA
Maximum Rise Time
5 ns
Maximum Fall Time
5 ns
Package / Case
DIL-SMT-3
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 40 C
Wavelength
900nm
Output Type
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
Q65110A2628
Lötbedingungen
Soldering Conditions
Reflow Lötprofil für bleifreies Löten
Reflow Soldering Profile for lead free soldering
Published by
OSRAM Opto Semiconductors GmbH
Leibnizstrasse 4, D-93055 Regensburg
www.osram-os.com
© All Rights Reserved.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components
1
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2
2011-02-08
A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
T
300
250
200
150
100
50
˚C
1
0
, may only be used in life-support devices or systems
0
255 ˚C
240 ˚C
217 ˚C
25 ˚C
Ramp Up
3 K/s (max)
50
120 s max
min. condition for IR Reflow Soldering:
solder point temperature ≥ 235 °C for at least 10 sec.
100
Recommended Solder Profile
Maximum Solder Profile
Minimum Solder Profile
7
SFH 2400, SFH 2400FA, SFH 2400FAR
150
Vorbehandlung nach JEDEC Level 4
Preconditioning acc. to JEDEC Level 4
(nach J-STD-020C)
(acc. to J-STD-020C)
2
with the express written approval of OSRAM OS.
200
100 s max
30 s max
Ramp Down
6 K/s (max)
10 s min
t
250
260 ˚C
245 ˚C
235 ˚C
OHLA0687
s
+0 ˚C
-5 ˚C
+5 ˚C
-0 ˚C
±5 ˚C
300

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