VBP104FAS Vishay, VBP104FAS Datasheet - Page 6

• Manufacturer Part Number: VBP104FAS
• Description: Photodiodes 60V 215mW 65Deg
• Manufacturer: Vishay
• Type: PIN Photodioder

Specifications of VBP104FAS

• Photodiode Material: Silicon
• Peak Wavelength: 950 nm
• Half Intensity Angle Degrees: 65 deg
• Maximum Reverse Voltage: 60 V
• Maximum Power Dissipation: 215 mW
• Maximum Light Current: 35 uA
• Maximum Dark Current: 30 nA
• Maximum Rise Time: 100 ns
• Maximum Fall Time: 100 ns
• Wavelength Typ: 950nm
• Half Angle: 65°
• Dark Current: 2nA
• Diode Case Style: SMD
• No. Of Pins: 2
• Operating Temperature Range: -40°C To +100°C
• Reverse Voltage Vr: 60V
• Breakdown Voltage Vbr: 60V
• Reverse Voltage Vr Max: 60V
• Rohs Compliant: Yes
• Forward Voltage Vf Max: 1.3V
• Featured Product: VBPW34x / VBP104x Series High-Speed PIN Photodiodes
• Wavelength: 950nm
• Output Type: Current On Typ, 35µA
• Package / Case: 2-SMD, Gull Wing
• Svhc: No SVHC (20-Jun-2011)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

VBP104FAS, VBP104FASR
Vishay Semiconductors
REEL DIMENSIONS FOR VBP104FAS AND VBP104FASR in millimeters
SOLDER PROFILE
www.vishay.com
6
19841
Fig. 8 - Lead (Pb)-free Reflow Solder Profile
300
250
200
150
100
50
0
0
21732
255 °C
240 °C
217 °C
max. ramp up 3 °C/s max. ramp down 6 °C/s
50
acc. J-STD-020
max. 120 s
100
Time (s)
150
For technical questions, contact:
max. 100 s
max. 30 s
200
max. 260 °C
250
245 °C
Silicon PIN Photodiode
300
[e-mail]
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Time between soldering and removing from MBB must not
exceed the time indicated in J-STD-020:
Moisture sensitivity: level 3
Floor life: 168 h
Conditions: T
DRYING
In case of moisture absorption devices should be baked
before
recommended conditions:
192 h at 40 °C (+ 5 °C), RH < 5 %
or
96 h at 60 °C (+ 5 °C), RH < 5 %.
soldering.
amb
< 30 °C, RH < 60 %
Conditions
Document Number: 81169
see
Rev. 1.0, 13-Aug-09
J-STD-020
or