ENW-89818C2JF Panasonic, ENW-89818C2JF Datasheet - Page 2

• Manufacturer Part Number: ENW-89818C2JF
• Description: Bluetooth / 802.15.1 Modules & Development Tools CC2560 HCI module no antenna
• Manufacturer: Panasonic

Specifications of ENW-89818C2JF

• Interface Type: I2C, SPI, UART
• Data Rate: 4 Mbps
• Operating Voltage: 3.3 V
• Board Size: 6.5 mm x 9 mm
• Operating Temperature Range: - 20 C to + 70 C
• Output Power: 10.5 dBm
• Technology/ Type: HCI Module
• Processor Series: CC2560
• For Use With/related Products: EVAL-PAN1315
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

CLASSIFICATION
SUBJECT
CUSTOMER’S CODE
PAN1315
PANASONIC ELECTRONIC DEVICES EUROPE GMBH
TABLE OF CONTENTS
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
Scope of this Document .................................................................................................. 4
Key Features................................................................................................................... 4
Applications for the Module............................................................................................. 5
Description for the Module .............................................................................................. 5
Detailed Description ........................................................................................................ 6
5.1. PAN1315 Terminal Layout..................................................................................... 6
5.2. Pin Description....................................................................................................... 7
5.3. Device Power Supply............................................................................................. 8
5.4. Clock Inputs ........................................................................................................... 9
Bluetooth Features........................................................................................................ 10
Block Diagram............................................................................................................... 11
Test Conditions ............................................................................................................. 12
General Device Requirements and Operation .............................................................. 12
9.1. Absolute Maximum Ratings ................................................................................. 12
9.2. Recommended Operating Conditions.................................................................. 13
9.3. Current Consumption........................................................................................... 13
9.4. General Electrical Characteristics........................................................................ 14
9.5. nSHUTD Requirements ....................................................................................... 14
9.6. External Digital Slow Clock Requirements (–20°C to +70°C) .............................. 14
Host Controller Interface ............................................................................................... 15
Audio/Voice Codec Interface......................................................................................... 15
11.1. PCM Hardware Interface ..................................................................................... 16
11.2. Data Format......................................................................................................... 16
11.3. Frame Idle Period ................................................................................................ 16
11.4. Clock-Edge Operation ......................................................................................... 18
11.5. Two-Channel PCM Bus Example ........................................................................ 18
11.6. Audio Encoding.................................................................................................... 18
11.7. Improved Algorithm For Lost Packets.................................................................. 18
11.8. Bluetooth/PCM Clock Mismatch Handling ........................................................... 19
11.9. Bluetooth Inter-IC Sound (I2S) ............................................................................ 19
11.10. Current Consumption for Different Bluetooth Scenarios .................................. 19
Bluetooth RF Performance (BT).................................................................................... 20
12.1. Bluetooth Characteristics..................................................................................... 20
Soldering Temperature-Time Profile (for reflow soldering) ........................................... 23
13.1. For lead solder..................................................................................................... 23
13.2. For leadfree solder............................................................................................... 23
Module Dimension ........................................................................................................ 24
PAN1315 FootPrint of the Module ................................................................................ 25
Labeling Drawing .......................................................................................................... 26
CLASS 1 or 2 BLUETOOTH MODULE
PRODUCT SPECIFICATION
PANASONIC’S CODE
ENW89818C2JF
No.
DS-1315-2400-102
PAGE
DATE
www.pedeu.pansonic.de
23.05.2011
2 of 41
REV.
1.03