TGA4502-SCC TriQuint, TGA4502-SCC Datasheet - Page 10

• Manufacturer Part Number: TGA4502-SCC
• Description: RF Amplifier 17-27 GHz 29dBm HPA
• Manufacturer: TriQuint
• Type: High Power Amplifierr

Specifications of TGA4502-SCC

• Operating Frequency: 17 GHz to 27 GHz
• P1db: 29 dBm
• Operating Supply Voltage: 8 V
• Supply Current: 1.1 A
• Maximum Power Dissipation: 8.8 W
• Package / Case: 1.52 mm x 3.29 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1025336

Bond pad #1
Bond pad #2
Bond pad #3
Bond pad #4
Bond pad #5
Bond pad #6
Bond pad #7
Bond pad #8
(0.027)
(0.544)
0.000
0.686
1.382
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Units: Millimeters (inches)
Thickness: 0.100 (0.004) (reference only)
Chip edge to bond pad dimensions are shown to center of bond pad
Chip size tolerance +/- 0.051 (0.002)
GND IS BACKSIDE OF MMIC
TriQuint Semiconductor Texas Phone: www.triquint.com [phone] Fax [phone] [e-mail]
1
(RF Input)
(RF Output)
VG2
DQ
VG3
VD3
DET OUT
PWR DET
15
3
14
0.200 x 0.100 (0.008 x 0.004)
0.200 x 0.100 (0.008 x 0.004)
0.100 x 0.100 (0.004 x 0.004)
0.100 x 0.100 (0.004 x 0.004)
0.100 x 0.100 (0.004 x 0.004)
0.180 x 0.100 (0.007 x 0.004)
0.100 x 0.100 (0.004 x 0.004)
0.175 x 0.100 (0.007 x 0.004)
13
4
Mechanical Drawing
12
5
Oct 2008 © Rev -
11
6
Bond pad #9
Bond pad #10
Bond pad #11
Bond pad #12
Bond pad #13
Bond pad #14
Bond pad #15
REF2
REF1
VD3
VG3
DQ
VG2
REF3
TGA4502-SCC
0.180 x 0.100 (0.007 x 0.004)
0.100 x 0.100 (0.004 x 0.004)
0.100 x 0.100 (0.004 x 0.004)
0.100 x 0.100 (0.004 x 0.004)
0.100 x 0.100 (0.004 x 0.004)
0.100 x 0.100 (0.004 x 0.004)
0.100 x 0.100 (0.004 x 0.004)
10
2
8
7
9
1.524
(0.060)
0.833
(0.033)
0.098
(.004)
0.373
(0.015)
10