73M1912-IM/F Maxim Integrated Products, 73M1912-IM/F Datasheet - Page 5

• Manufacturer Part Number: 73M1912-IM/F
• Description: Interface - Specialized MICRODAA CHIP SET LN SIDE
• Manufacturer: Maxim Integrated Products
• Type: Host Interface Chipr

Specifications of 73M1912-IM/F

• Operating Supply Voltage: 3.3 V
• Supply Current: 25 mA
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Package / Case: TSSOP-20
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

UM_1922_006
1 Introduction
The 73M1922 MicroDAA Chipset Demo Board integrates silicon Data Access Arrangement (DAA)
function along with Analog Front End functions chipsets for worldwide compliance.
The 73M1922 MicroDAA chipset consists of a 73M1902 and a 73M1912. The 73M1902 is the Host
Interface Chip (HIC) providing a host microprocessor or DSP interface by a synchronous serial port
(Modem Analog Front End (MAFE)) and the 73M1912 is the Line Interface Chip (LIC) to connect to a
telephone line.
The 73M1922 chipset is packaged in two 20-pin TSSOP or two 32-pin QFN packages for a very small
physical dimension and offers low cost global DAA design.
The 73M1922 performs a modem codec function that interfaces a Host/DSP and the PSTN (Public
Switched Telephone Network). The codec supports data rates up to V.92 with call progress signaling. In
addition to the codec function, the 73M1922 MicroDAA chipset also performs other necessary DAA
functions, such as CID (caller identification), ring detection, tip/ring polarity reversal detection, on/off hook
switch control, pulse dialing, regulation of loop current (DC-IV), line impedance matching, line in use and
parallel pickup detection.
transformer barrier. Also all clock and synchronization information needed in LIC is embedded in this
data and control bit stream across the barrier transformer received from HIC and reconstructed within
LIC. The LIC interface to tip/ring of the PSTN significantly lowers the number of external components and
their cost.
The DAA feature integrated in this chipset offers a configurable US, ETSI ES 203 021-2, or other World
Wide DAA capability to the telephone line interface and an auxiliary DAC with gain control for line
monitoring during the call progress period.
Rev. 5.1
All data and control information between the LIC and the HIC is transferred across a low cost pulse
O
H
S
N
E
R
A
C
E
T
T
F
I
INT/RGDT
Shaded pins and names are optional depending on packages
OSCOUT
SDOUT
OSCIN
SCKM
SCLK
TYPE
GPIO
AOUT
SDIN
FSB
Figure 1: MicroDAA System Block Diagram
M/S
FS
1902
73M
TRANSFORMER
73M1922
PULSE
1912
73M
73M1922 Demo Board User Manual
RGP
RGN
OFH
DCD
DCB
DCE
RXM
TXN
RXP
SRE
ACS
SRB
DCI
N
N
R
C
L
E
T
E
F
A
E
I
I
5