VNC2-48L1B-REEL FTDI, VNC2-48L1B-REEL Datasheet - Page 89
![USB Interface IC Vinculum-II Dual USB Host/Dev IC LQFP-48](/photos/16/10/161047/vnc48lqfp_image_1_sml.jpg)
VNC2-48L1B-REEL
Manufacturer Part Number
VNC2-48L1B-REEL
Description
USB Interface IC Vinculum-II Dual USB Host/Dev IC LQFP-48
Manufacturer
FTDI
Type
USB Host/Device Controllerr
Datasheet
1.VNC2-32Q1B-REEL.pdf
(90 pages)
Specifications of VNC2-48L1B-REEL
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Operating Temperature Range
- 40 C to + 85 C
Supply Current
25 mA
Operating Supply Voltage
1.8 V, 3.3V
Package / Case
LQFP-48
Description/function
USB Vinculum-II Dual Host/Dev IC LQFP-48
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
VINCULUM2
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
VNC2-48L1B-REEL
Manufacturer:
TELIT
Quantity:
879
Company:
Part Number:
VNC2-48L1B-REEL
Manufacturer:
FTDI, Future Technology Devices International Ltd
Quantity:
10 000
Document No.: FT_000138
VINCULUM-II EMBEDDED DUAL USB HOST CONTROLLER IC Datasheet
1.2
Version -
143
Clearance No.: FTDI#
Figure 7-1 USB Modes ................................................................................................................. 68
Figure 10-1 VNC2 Schematic (MCU - UART Interface) ...................................................................... 76
Figure 11-1 Package Markings ...................................................................................................... 77
Figure 11-2 Markings – 32 QFN .................................................................................................... 77
Figure 11-3 LQFP-32 Package Dimensions ..................................................................................... 78
Figure 11-4 QFN-32 Package Dimensions ....................................................................................... 79
Figure 11-5 LQFP-48 Package Dimensions ..................................................................................... 80
Figure 11-6 64 pin LQFP Package Details ....................................................................................... 82
Figure 11-7 64 pin QFN Package Details ........................................................................................ 83
Figure 11-8 All packages Reflow Solder Profile ................................................................................ 84
Copyright © 2010 Future Technology Devices International Limited
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