FT245RQ-REEL FTDI, FT245RQ-REEL Datasheet - Page 32

• Manufacturer Part Number: FT245RQ-REEL
• Description: USB Interface IC USB to Parallel FIFO Enhanced IC QFN-32
• Manufacturer: FTDI

Specifications of FT245RQ-REEL

• Mounting Style: SMD/SMT
• Package / Case: QFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

10.5 Solder Reflow Profile
The FT245R is supplied in Pb free 28 LD SSOP and QFN-32 packages. The recommended solder reflow
profile for both package options is shown in 0.
Figure 10.5 FT245R Solder Reflow Profile
The recommended values for the solder reflow profile are detailed in Table 10.1. Values are shown for
both a completely Pb free solder process (i.e. the FT245R is used with Pb free solder), and for a non-Pb
free solder process (i.e. the FT245R is used with non-Pb free solder).
Table 10.1 Reflow Profile Parameter Values
Profile Feature
Preheat
- Temperature Min (T
- Temperature Max (T
- Time (t
Time Maintained Above Critical
Temperature T
- Temperature (T
- Time (t
Time within 5°C of actual Peak
Temperature (t
Time for T= 25°C to Peak Temperature,
T
Average Ramp Up Rate (T
Peak Temperature (T
Ramp Down Rate
p
s
L
)
Min to t
25
T
T
p
L
L
p
T Max
:
T Min
S
)
S
L
s
Copyright © 2010 Future Technology Devices International Limited
)
Max)
s
p
s
)
Min.)
Max.)
s
to T
T = 25º C to T
Preheat
Time, t (seconds)
p
)
t
S
P
Ramp Up
Pb Free Solder Process
3°C / second Max.
150°C
200°C
60 to 120 seconds
217°C
60 to 150 seconds
260°C
20 to 40 seconds
6°C / second Max.
8 minutes Max.
FT245R USB FIFO IC Datasheet Version 2.10
t
p
t
L
Non-Pb Free Solder Process
3°C / Second Max.
100°C
150°C
60 to 120 seconds
183°C
60 to 150 seconds
240°C
20 to 40 seconds
6°C / second Max.
6 minutes Max.
Document No.: FT_000052
Ramp
Down
Clearance No.: FTDI# 39
Critical Zone: when
T is in the range
T to T
L
p
32