BLM18GG471SN1D Murata, BLM18GG471SN1D Datasheet - Page 181

• Manufacturer Part Number: BLM18GG471SN1D
• Description: EMI/RFI Suppressors & Ferrites 470ohms Hi-GHz General Usage
• Manufacturer: Murata

Specifications of BLM18GG471SN1D

• Shielding: Unshielded
• Test Frequency: 100 MHz
• Product: Chip Ferrite Beads
• Impedance: 470 Ohms
• Tolerance: 25 %
• Maximum Dc Current: 200 mAmps
• Maximum Dc Resistance: 1.3 Ohms
• Operating Temperature Range: - 55 C to + 125 C
• Package / Case: 0603 (1608 metric)
• Termination Style: SMD/SMT
• Frequency Range: 100MHz To 1GHz
• Dc Resistance Max: 1ohm
• Dc Current Rating: 200mA
• Ferrite Mounting: SMD
• Ferrite Case Style: 0603 / 1608
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

DLp Chip Common Mode Choke Coil
(3) Reworking with Solder Iron
!Note
(1) Cleaning Temperature: 60 C max. (40 C max. for
(2) Ultrasonic
(3) Cleaning agent
4. Cleaning
The following conditions must be strictly followed when
using a soldering iron.
Pre-heating: 150 C 60s min.
Soldering iron power output / Tip diameter:
Temperature of soldering iron tip / Soldering time / Times:
Following conditions should be observed when cleaning
chip EMI filter.
alcohol type cleaner)
Output: 20W/liter max.
Duration: 5 minutes max.
Frequency: 28 to 40kHz
The following list of cleaning agents have been tested on
the individual components. Evaluation of final assembly
should be completed prior to production.
Do not clean DLW (except DLW21H) series.
*
1
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
30W max. / ø3mm max.
350 C max. / 3-4s / 2 times*
380 C max. / 3-4s / 2 times
DLP0NS, DLP11S, DLP11T, DLP1ND, DLP2AD:
1
Soldering and Mounting
(4) Ensure that flux residue is completely removed.
For additional methods of reworking with a soldering iron,
please contact Murata engineering.
Before cleaning, please contact Murata engineering.
(a) Alcohol cleaning agent
(b) Aqueous cleaning agent
Component should be thoroughly dried after aqueous
agent has been removed with deionized water.
Do not allow the tip of the soldering iron to directly
contact the chip.
Isopropyl alcohol (IPA)
Pine Alpha ST-100S
179
Mar.28,2011
C31E.pdf